Apple 24-Core M1 Max

24-Core M1 Max

Intel Arc 130V 1850MHz

Arc 130V 1850MHz

Apple 24-Core M1 Max vs Intel Arc 130V 1850MHz Full Specs

3,072 Shaders
1.3GHz
896 Shaders
1.85GHz
Shared Memory409.6GB/sLPDDR5
Shared Memory136.5GB/sLPDDR5X
··
7.96 TFLOPS
··
3.31 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

24-Core M1 Max24-Core M1 Max7.96 TFLOPSFP16
x1
Arc 130V 1850MHzArc 130V 1850MHz106.1 TOPSINT4 Tensor
x13.32

Clock Speed
··
Clock Speed
··
Peak OPS
7.96 TFLOPSFP16
Peak OPS
106.1 TOPSINT4 Tensor
FP16
7.96 TFLOPS
Tensor FP16-32
-
FP16
6.63 TFLOPS
Tensor FP16-32
26.52 TFLOPS
-
Tensor BF16
26.52 TFLOPS
FP32
7.96 TFLOPS
FP32
3.31 TFLOPS
-
FP64
828.8 GFLOPS
Tensor INT4
-
Tensor INT4
106.1 TOPS
-
Tensor INT8
53.04 TOPS
Pixel Rate
124.4 GPixel/s
Pixel Rate
51.8 GPixel/s
Texture Rate
248.8 GTexel/s
Texture Rate
103.6 GTexel/s

Shaders
3,072 Shaders
Shaders
896 Shaders
TMUs
192 TMUs
TMUs
56 TMUs
ROPs
96 ROPs
ROPs
28 ROPs
Tensor Cores
-
Tensor Cores
56 T-Cores
RT Cores
-
RT Cores
7 RT-Cores
EUs
384 EUs
EUs
56 EUs

Boost Clock
1.3GHz
Boost Clock
1.85GHz

L1
-
L1
192KB/SM
L2 Cache
4MB shared
L2 Cache
7MB shared

Shared MemoryLPDDR5
Shared MemoryLPDDR5X
Memory Bus
512-bit
Memory Bus
128-bit
Memory Speed
6.4GT/s
Memory Speed
8.5GT/s
Memory Bandwidth
409.6GB/s
Memory Bandwidth
136.5GB/s
ECC
No
ECC
No

Max Resolution
6016x3384
Max Resolution
7680x4320
Refresh Rate Calculator
6016x3384
Resolution6K
Refresh Rate
60Hz
Refresh Rate Calculator
7680x4320
Resolution8K UHD
Refresh Rate
60Hz
Multi-Monitor
4
Multi-Monitor
3
DSC
Supported
DSC
Supported

Shader Model
-
Shader Model
6.4
-
DirectX
DirectX 12
Direct3D
12_2
-
OpenGL
4.6
OpenCL
3
Vulkan
1.2

Encoder
2x Apple Media Engine 2
Encoder
Xe Media Engine
Codec
-
AVC (H.264)
HEVC (H.265)
-
ProRes
Codec
VP9
AVC (H.264)
HEVC (H.265)
AV1
-

Decoder
Apple Media Engine 2
Decoder
Xe Media Engine
Codec
-
-
-
-
-
AVC (H.264)
HEVC (H.265)
-
-
ProRes
Codec
MPEG-2
JPEG
VC-1
VP8
VP9
AVC (H.264)
HEVC (H.265)
VVC (H.266)
AV1
-

Form Factor
iGPU
Form Factor
iGPU
Cooling
Blower
2x Fans
Cooling
Open-Air
-

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
M1 Max branding
Branding
Arc branding
Codename
G13C
Codename
Xe2 LPG
Chip Variant
-
Chip Variant
GT2
Market Segment
Desktop
Market Segment
Laptop
Release Date
Oct 26, 2021
Release Date
Sep 3, 2024

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N5
Fabrication Node
N3B
Die Size
432mm²
Die Size
140mm²
Transistor Count
57B
Transistor Count
-
Transistor Density
132 MTr/mm²
Transistor Density
-