Apple 3-Core A11 vs Apple 4-Core A12 Full Specs
192 Shaders 1.14GHz | 256 Shaders 1.1GHz |
Shared Memory34.1GB/sLPDDR4X | Shared Memory34.1GB/sLPDDR4X |
·· 437.8 GFLOPS | ·· 562.2 GFLOPS |
Form Factor iGPU | Form Factor iGPU |
TDP Shared | TDP Shared |
3-Core A11437.8 GFLOPSFP16
4-Core A12562.2 GFLOPSFP16Clock Speed ·· | Clock Speed ·· |
Peak OPS 437.8 GFLOPSFP16 | Peak OPS 562.2 GFLOPSFP16 |
FP32 437.8 GFLOPS | FP32 562.2 GFLOPS |
Pixel Rate 6.8 GPixel/s | Pixel Rate 8.8 GPixel/s |
Texture Rate 13.7 GTexel/s | Texture Rate 17.6 GTexel/s |
Shaders 192 Shaders | Shaders 256 Shaders |
TMUs 12 TMUs | TMUs 16 TMUs |
ROPs 6 ROPs | ROPs 8 ROPs |
EUs 24 EUs | EUs 32 EUs |
Boost Clock 1.14GHz | Boost Clock 1.1GHz |
L2 Cache 96KB shared | L2 Cache 128KB shared |
Shared MemoryLPDDR4X | Shared MemoryLPDDR4X |
Memory Bus 64-bit | Memory Bus 64-bit |
Memory Speed 4.3GT/s | Memory Speed 4.3GT/s |
Memory Bandwidth 34.1GB/s | Memory Bandwidth 34.1GB/s |
ECC No | ECC No |
Multi-Monitor 1 | Multi-Monitor 1 |
Form Factor iGPU | Form Factor iGPU |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename G10P | Codename G11P |
Market Segment Smartphone | Market Segment Smartphone |
Release Date Sep 22, 2017 | Release Date Sep 12, 2018 |
Foundry TSMC | Foundry TSMC |
Fabrication Node 10FF | Fabrication Node N7 |
Die Size 88mm² | Die Size 83mm² |
Transistor Count 4.3 Billion | Transistor Count 6.9 Billion |
Transistor Density 49 MTr/mm² | Transistor Density 83 MTr/mm² |
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CPUs | CPUs |
Smartphones | Smartphones |
Tablets - | Tablets |