GPUs

Apple 30-Core M2 Max vs Intel Arc 130V 1850MHz Full Specs

3,840 Shaders
1.4GHz
896 Shaders
1.85GHz
Shared Memory409.6GB/sLPDDR5
Shared Memory136.5GB/sLPDDR5X
··
10.74 TFLOPS
··
3.31 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

30-Core M2 Max30-Core M2 Max10.74 TFLOPSFP16
x1
Arc 130V 1850MHzArc 130V 1850MHz106.1 TOPSINT4 Tensor
x9.88

Clock Speed
··
Clock Speed
··
Peak OPS
10.74 TFLOPSFP16
Peak OPS
106.1 TOPSINT4 Tensor
-
Tensor FP16-32
26.52 TFLOPS
-
Tensor BF16
26.52 TFLOPS
FP32
10.74 TFLOPS
FP32
3.31 TFLOPS
-
FP64
828.8 GFLOPS
Tensor INT4
-
Tensor INT4
106.1 TOPS
-
Tensor INT8
53.04 TOPS
Pixel Rate
167.8 GPixel/s
Pixel Rate
51.8 GPixel/s
Texture Rate
335.5 GTexel/s
Texture Rate
103.6 GTexel/s

Shaders
3,840 Shaders
Shaders
896 Shaders
TMUs
240 TMUs
TMUs
56 TMUs
ROPs
120 ROPs
ROPs
28 ROPs
Tensor Cores
-
Tensor Cores
56 T-Cores
RT Cores
-
RT Cores
7 RT-Cores
EUs
480 EUs
EUs
56 EUs

Boost Clock
1.4GHz
Boost Clock
1.85GHz

L2 Cache
8.2MB shared
L2 Cache
7.2MB shared

Shared MemoryLPDDR5
Shared MemoryLPDDR5X
Memory Bus
512-bit
Memory Bus
128-bit
Memory Speed
6.4GT/s
Memory Speed
8.5GT/s
Memory Bandwidth
409.6GB/s
Memory Bandwidth
136.5GB/s

Multi-Monitor
4
Multi-Monitor
3

Encoder Model
2x Apple Media Engine 2
Encoder Model
Xe Media Engine

Decoder Model
Apple Media Engine 2
Decoder Model
Xe Media Engine

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
M2 Max branding
Branding
Arc branding
Codename
G14C
Codename
Xe2 LPG
Chip Variant
-
Chip Variant
GT2
Market Segment
Desktop
Market Segment
Laptop
Release Date
Jan 17, 2023
Release Date
Sep 3, 2024

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N5P
Fabrication Node
N3B
Die Size
486mm²
Die Size
140mm²
Transistor Count
67 Billion
Transistor Count
-
Transistor Density
138 MTr/mm²
Transistor Density
-

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