Apple 30-Core M3 Max vs Apple 5-Core A17 Pro Full Specs

Summary

3,840 Shaders 1.38GHz	640 Shaders 1.34GHz
Shared Memory307.2GB/sLPDDR5	Shared Memory51.2GB/sLPDDR5
Peak·FP32·FP16 10.6 TFLOPS	Peak·FP32·FP16 1.71 TFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 Memory Bandwidth

30-Core M3 Max10.6 TFLOPSFP16

x6.19

5-Core A17 Pro1.71 TFLOPSFP16

x1

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Theoretical Performance

Clock Speed1380MHz UC·Boost·OC	Clock Speed1338MHz UC·Boost·OC
Peak OPS 10.6 TFLOPSFP16	Peak OPS 1.71 TFLOPSFP16
FP32 10.6 TFLOPS	FP32 1.71 TFLOPS
Pixel Rate 165.6 GPixel/s	Pixel Rate 26.8 GPixel/s
Texture Rate 331.2 GTexel/s	Texture Rate 53.5 GTexel/s

Core Config

Shaders 3,840 Shaders	Shaders 640 Shaders
TMUs 240 TMUs	TMUs 40 TMUs
ROPs 120 ROPs	ROPs 20 ROPs
RT Cores 30 RT-Cores	RT Cores 5 RT-Cores
EUs 480 EUs	EUs 80 EUs

Clocks

Boost Clock 1.38GHz

Boost Clock 1.34GHz

Cache

L2 Cache 8MB shared

L2 Cache 768KB shared

Memory

Shared MemoryLPDDR5	Shared MemoryLPDDR5
Memory Bus 384-bit	Memory Bus 64-bit
Memory Speed 6.4GT/s	Memory Speed 6.4GT/s
Memory Bandwidth 307.2GB/s	Memory Bandwidth 51.2GB/s
ECC No	ECC No

Video Output

Max Resolution 7680x4320	Max Resolution 3840x2160
Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 60Hz	Refresh Rate Calculator 3840x2160 Resolution4K UHD Refresh Rate 60Hz
Multi-Monitor 4	Multi-Monitor 1
DSC Supported	DSC Not Supported

Encoder

Encoder 2x Apple Media Engine 3	Encoder Apple Media Engine 3
Codec AVC (H.264) HEVC (H.265) ProRes	Codec AVC (H.264) HEVC (H.265) ProRes

Decoder

Decoder Apple Media Engine 3	Decoder Apple Media Engine 3
Codec AVC (H.264) HEVC (H.265) AV1 ProRes	Codec AVC (H.264) HEVC (H.265) AV1 ProRes

Card

Form Factor iGPU	Form Factor iGPU
Cooling Blower 2x Fans	Cooling Open-Air -

Chip

Manufacturer Apple	Manufacturer Apple
Chip Designer Apple	Chip Designer Apple
Architecture Apple Gen 6	Architecture Apple Gen 6
Family M Series	Family A Series
Branding	Branding
Codename G15M	Codename G16P
Market Segment Desktop	Market Segment Smartphone
Release Date Oct 30, 2023	Release Date Oct 15, 2024

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N3B	Fabrication Node N3B
Die Size 477mm²	Die Size 104mm²
Transistor Count 92B	Transistor Count 19B
Transistor Density 193 MTr/mm²	Transistor Density 183 MTr/mm²

Images