Apple 32-Core M4 Max vs Apple 4-Core A16 Full Specs - HMC

4,096 Shaders 1.58GHz	512 Shaders 1.34GHz
Shared Memory409.6GB/sLPDDR5X	Shared Memory51.2GB/sLPDDR5
·· 12.93 TFLOPS	·· 1.37 TFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

32-Core M4 Max

32-Core M4 Max12.93 TFLOPSFP16

x9.43

4-Core A16

4-Core A161.37 TFLOPSFP16

x1

Clock Speed ··	Clock Speed ··
Peak OPS 12.93 TFLOPSFP16	Peak OPS 1.37 TFLOPSFP16
FP32 12.93 TFLOPS	FP32 1.37 TFLOPS
Pixel Rate 202 GPixel/s	Pixel Rate 21.4 GPixel/s
Texture Rate 404 GTexel/s	Texture Rate 42.8 GTexel/s

Shaders 4,096 Shaders	Shaders 512 Shaders
TMUs 256 TMUs	TMUs 32 TMUs
ROPs 128 ROPs	ROPs 16 ROPs
RT Cores 32 RT-Cores	RT Cores -
EUs 512 EUs	EUs 64 EUs

Boost Clock

1.58GHz

Boost Clock

1.34GHz

L2 Cache

8MB shared

L2 Cache

512KB shared

Shared MemoryLPDDR5X	Shared MemoryLPDDR5
Memory Bus 384-bit	Memory Bus 64-bit
Memory Speed 8.5GT/s	Memory Speed 6.4GT/s
Memory Bandwidth 409.6GB/s	Memory Bandwidth 51.2GB/s
ECC No	ECC No

Max Resolution 7680x4320	Max Resolution 3840x2160
Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 120Hz	Refresh Rate Calculator 3840x2160 Resolution4K UHD Refresh Rate 60Hz
Multi-Monitor 4	Multi-Monitor 1
DSC Supported	DSC Not Supported

Encoder 2x Apple Media Engine 3	-
Codec AVC (H.264) HEVC (H.265) ProRes	Codec -

Decoder 2x Apple Media Engine 3	-
Codec AVC (H.264) HEVC (H.265) AV1 ProRes	Codec -

Form Factor iGPU	Form Factor iGPU
Cooling Blower 2x Fans	Cooling Open-Air -

Manufacturer Apple	Manufacturer Apple
Chip Designer Apple	Chip Designer Apple
Architecture Apple Gen 7	Architecture Apple Gen 5
Family M Series	Family A Series
Branding	Branding
Codename G16M	Codename G15P
Market Segment Laptop	Market Segment Smartphone
Release Date Oct 30, 2024	Release Date Mar 4, 2025

Foundry TSMC	Foundry TSMC
Fabrication Node N3E	Fabrication Node N4P
Die Size 454mm²	Die Size 115mm²
Transistor Count 76B	Transistor Count 16B
Transistor Density 167 MTr/mm²	Transistor Density 139 MTr/mm²