Apple 32-Core M4 Max vs Intel HD 3000 1200MHz Full Specs

Summary

4,096 Shaders 1.58GHz	96 Shaders 1.2GHz
Shared Memory409.6GB/sLPDDR5X	Shared Memory25.6GB/sDDR3
Peak·FP32·FP16 12.93 TFLOPS	Peak·FP32·FP16 230.4 GFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 Memory Bandwidth

32-Core M4 Max12.93 TFLOPSFP16

x56.11

HD 3000 1200MHz230.4 GFLOPSFP32

x1

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Theoretical Performance

Clock Speed1578MHz UC·Boost·OC	Clock Speed1200MHz UC·Base·Boost·OC
Peak OPS 12.93 TFLOPSFP16	Peak OPS 230.4 GFLOPSFP32
FP16 12.93 TFLOPS	-
FP32 12.93 TFLOPS	FP32 230.4 GFLOPS
Pixel Rate 202 GPixel/s	Pixel Rate 2.4 GPixel/s
Texture Rate 404 GTexel/s	Texture Rate 14.4 GTexel/s

Core Config

Shaders 4,096 Shaders	Shaders 96 Shaders
TMUs 256 TMUs	TMUs 12 TMUs
ROPs 128 ROPs	ROPs 2 ROPs
RT Cores 32 RT-Cores	RT Cores -
EUs 512 EUs	EUs 12 EUs

Clocks

Base Clock -	Base Clock 650MHz
Boost Clock 1.58GHz	Boost Clock 1.2GHz

Cache

L2 Cache 8MB shared

L2 Cache -

Memory

Shared MemoryLPDDR5X	Shared MemoryDDR3
Memory Bus 384-bit	Memory Bus 128-bit
Memory Speed 8.5GT/s	Memory Speed 1.6GT/s
Memory Bandwidth 409.6GB/s	Memory Bandwidth 25.6GB/s
ECC No	ECC No

Video Output

Max Resolution 7680x4320	Max Resolution 2560x1600
Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 120Hz	Refresh Rate Calculator 2560x1440 Resolution1440p QHD Refresh Rate 66Hz
Multi-Monitor 4	Multi-Monitor 2
DSC Supported	DSC Not Supported

API Support

Shader Model -	Shader Model 4.1
-	DirectX DirectX 11 Direct3D 10_1
-	OpenGL 3.1

Encoder

Encoder 2x Apple Media Engine 3	Encoder Quick Sync Video 1
Codec AVC (H.264) HEVC (H.265) ProRes	Codec AVC (H.264) - -

Decoder

Decoder Apple Media Engine 3	Decoder Quick Sync Video 1
Codec - - - - AVC (H.264) HEVC (H.265) AV1 ProRes	Codec MPEG-1 MPEG-2 MPEG-4 VC-1 AVC (H.264) - - -

Card

Form Factor iGPU	Form Factor iGPU
Cooling Blower 2x Fans	Cooling Open-Air -

Chip

Manufacturer Apple	Manufacturer Intel
Chip Designer Apple	Chip Designer Intel
Architecture Apple Gen 7	Architecture Gen 6
Family M Series	Family Gen 6
Branding	Branding
Codename G16C	Codename Sandy Bridge
Chip Variant -	Chip Variant GT1
Market Segment Laptop	Market Segment Smartphone
Release Date Oct 30, 2024	Release Date Feb 1, 2011

Fabrication

Foundry TSMC	Foundry Intel
Fabrication Node N3E	Fabrication Node 32nm
Die Size 454mm²	Die Size 216mm²
Transistor Count 76B	Transistor Count 1.2B
Transistor Density 167 MTr/mm²	Transistor Density 5 MTr/mm²

Images