Apple 4-Core A14+ vs Apple 10-Core M5-FL Full Specs

Summary

256 Shaders 1.28GHz	1,280 Shaders 1.58GHz
Shared Memory34.1GB/sLPDDR4X	Shared Memory153.6GB/sLPDDR5X
Peak·FP32·FP16 654.3 GFLOPS	Peak·FP32·FP16 4.04 TFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Theoretical Performance

Clock Speed1278MHz UC·Boost·OC	Clock Speed1578MHz UC·Boost·OC
Peak OPS 654.3 GFLOPSFP16	Peak OPS 32.32 TOPSINT8 Tensor
-	Tensor FP16-16 8.08 TFLOPS Tensor FP16-32 8.08 TFLOPS
-	Tensor BF16 16.16 TFLOPS
FP32 654.3 GFLOPS	FP32 4.04 TFLOPS
-	Tensor INT8 32.32 TOPS
Pixel Rate 10.2 GPixel/s	Pixel Rate 63.1 GPixel/s
Texture Rate 20.4 GTexel/s	Texture Rate 126.2 GTexel/s

Core Config

Shaders 256 Shaders	Shaders 1,280 Shaders
TMUs 16 TMUs	TMUs 80 TMUs
ROPs 8 ROPs	ROPs 40 ROPs
Tensor Cores -	Tensor Cores 10 T-Cores
RT Cores -	RT Cores 10 RT-Cores
EUs 32 EUs	EUs 160 EUs

Clocks

Boost Clock 1.28GHz

Boost Clock 1.58GHz

Cache

L2 Cache 384KB shared

L2 Cache 2MB shared

Memory

Shared MemoryLPDDR4X	Shared MemoryLPDDR5X
Memory Bus 64-bit	Memory Bus 128-bit
Memory Speed 4.3GT/s	Memory Speed 9.6GT/s
Memory Bandwidth 34.1GB/s	Memory Bandwidth 153.6GB/s
ECC No	ECC No

Video Output

Multi-Monitor 1

Multi-Monitor 2

Encoder

-	Encoder Model Apple Media Engine 3
Codec -	Codec AVC (H.264) HEVC (H.265) ProRes

Decoder

-	Decoder Model Apple Media Engine 3
Codec -	Codec AVC (H.264) HEVC (H.265) AV1 ProRes

Card

Form Factor iGPU

Form Factor iGPU

Chip

Manufacturer Apple	Manufacturer Apple
Chip Designer Apple	Chip Designer Apple
Architecture Apple Gen 4	Architecture Apple Gen 8
Family A Series	Family M Series
Branding	Branding
Codename G13P	Codename G17G
Market Segment Smartphone	Market Segment Tablet
Release Date Oct 23, 2020	Release Date Oct 15, 2025

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N5	Fabrication Node N3P
Die Size 88mm²	Die Size -
Transistor Count 11.8 Billion	Transistor Count -
Transistor Density 134 MTr/mm²	Transistor Density -

Images