GPUs

Apple 4-Core A16 vs Apple 4-Core A19 Full Specs

512 Shaders
1.34GHz
512 Shaders
1.47GHz
Shared Memory51.2GB/sLPDDR5
Shared Memory68.3GB/sLPDDR5X
··
1.37 TFLOPS
··
1.5 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

4-Core A164-Core A161.37 TFLOPSFP16
x1
4-Core A194-Core A193.01 TFLOPSFP8-16 Tensor
x2.20

Clock Speed
··
Clock Speed
··
Peak OPS
1.37 TFLOPSFP16
Peak OPS
3.01 TFLOPSFP8-16 Tensor
-
Tensor FP8-16
3.01 TFLOPS
Tensor FP8-32
3.01 TFLOPS
-
Tensor FP16-16
1.5 TFLOPS
Tensor FP16-32
1.5 TFLOPS
FP32
1.37 TFLOPS
FP32
1.5 TFLOPS
Pixel Rate
21.4 GPixel/s
Pixel Rate
23.5 GPixel/s
Texture Rate
42.8 GTexel/s
Texture Rate
47 GTexel/s

Shaders
512 Shaders
Shaders
512 Shaders
TMUs
32 TMUs
TMUs
32 TMUs
ROPs
16 ROPs
ROPs
16 ROPs
Tensor Cores
-
Tensor Cores
4 T-Cores
RT Cores
-
RT Cores
4 RT-Cores
EUs
64 EUs
EUs
64 EUs

Boost Clock
1.34GHz
Boost Clock
1.47GHz

L2 Cache
512KB shared
L2 Cache
1MB shared

Shared MemoryLPDDR5
Shared MemoryLPDDR5X
Memory Bus
64-bit
Memory Bus
64-bit
Memory Speed
6.4GT/s
Memory Speed
8.5GT/s
Memory Bandwidth
51.2GB/s
Memory Bandwidth
68.3GB/s

Multi-Monitor
1
Multi-Monitor
1

-
Encoder Model
Apple Media Engine 3

-
Decoder Model
Apple Media Engine 3

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
A16 branding
Branding
A19 branding
Codename
G15P
Codename
G18A
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Mar 4, 2025
Release Date
Mar 2, 2026

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N4P
Fabrication Node
N3P
Die Size
115mm²
Die Size
83mm²
Transistor Count
16 Billion
Transistor Count
14.3 Billion
Transistor Density
139 MTr/mm²
Transistor Density
172 MTr/mm²

No images available
No images available

CPUs
CPUs
Smartphones
-
Smartphones
Tablets
Tablets
-