Apple 4-Core A19 vs NVIDIA Quadro P620 Full Specs

Summary

512 Shaders 1.47GHz	512 Shaders 1.35GHz
Shared Memory68.3GB/sLPDDR5X	2GB GDDR564.2GB/s placeholder
Peak·FP32·FP16 1.5 TFLOPS	Peak·FP32·FP16 1.39 TFLOPS
Form Factor iGPU	Form Factor PCIe Card
TDP Shared	TDP 40W

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP8-16 Tensor FP8-32 Tensor FP16-16 Tensor FP16-32 FP64 Memory Bandwidth TDP

4-Core A193.01 TFLOPSFP8-16 Tensor

x2.17

Quadro P6201.39 TFLOPSFP32

x1

Show Top Score

Theoretical Performance

Clock Speed1470MHz UC·Boost·OC	Clock Speed1354MHz UC·Base·Boost·OC
Peak OPS 3.01 TFLOPSFP8-16 Tensor	Peak OPS 1.39 TFLOPSFP32
Tensor FP8-16 3.01 TFLOPS Tensor FP8-32 3.01 TFLOPS	-
Tensor FP16-16 1.5 TFLOPS Tensor FP16-32 1.5 TFLOPS	-
FP32 1.5 TFLOPS	FP32 1.39 TFLOPS
-	FP64 43.33 GFLOPS
Pixel Rate 23.5 GPixel/s	Pixel Rate 21.7 GPixel/s
Texture Rate 47 GTexel/s	Texture Rate 43.3 GTexel/s

Core Config

Shaders 512 Shaders	Shaders 512 Shaders
TMUs 32 TMUs	TMUs 32 TMUs
ROPs 16 ROPs	ROPs 16 ROPs
Tensor Cores 4 T-Cores	Tensor Cores -
RT Cores 4 RT-Cores	RT Cores -
EUs 64 EUs	SMs 4 SMs

Clocks

Base Clock -	Base Clock 1.27GHz
Boost Clock 1.47GHz	Boost Clock 1.35GHz

Cache

L2 Cache 1MB shared

L2 Cache 768KB shared

Memory

Shared MemoryLPDDR5X	2GB GDDR5 placeholder
Memory Bus 64-bit	Memory Bus 128-bit
Memory Speed 8.5GT/s	Memory Speed 4GT/s
Memory Bandwidth 68.3GB/s	Memory Bandwidth 64.2GB/s
ECC No	ECC No

Power & Thermals

TDP Shared

TDP 40W

Video Output

Multi-Monitor 1

Multi-Monitor 3

Ports

-	4x Mini DisplayPort 1.4

Encoder

Encoder Model Apple Media Engine 3

Encoder Model NVENC 4

Decoder

Decoder Model Apple Media Engine 3

Decoder Model NVDEC 3

Card

Form Factor iGPU	Form Factor PCIe Card
PCIe -	PCIe 1-Slots
-	Height 69 mm (2.72") Width 150 mm (5.91") Depth 20 mm (0.79")
Cooling Open-Air -	Cooling Blower 1x Fan

Chip

Manufacturer Apple	Manufacturer NVIDIA
Chip Designer Apple	Chip Designer NVIDIA
Architecture Apple Gen 8	Architecture Pascal
Family A Series	Family Quadro P
Branding	Branding
Codename G18A	Codename NV137
Chip Variant -	Chip Variant GP107-300-A1
Market Segment Smartphone	Market Segment Workstation
Release Date Mar 2, 2026	Release Date Feb 1, 2018

Fabrication

Foundry TSMC	Foundry Samsung
Fabrication Node N3P	Fabrication Node 14LPP
Die Size 83mm²	Die Size 132mm²
Transistor Count 14.3 Billion	Transistor Count 3.3 Billion
Transistor Density 172 MTr/mm²	Transistor Density 25 MTr/mm²

Images

No images available

No images available

Used In

CPUs A19 (17e)	CPUs -
Smartphones iPhone 17e	Smartphones -

Competitors

Apple4-Core A19 vs GPU Apple5-Core A18 Pro Apple4-Core A19 vs GPU Apple5-Core A19 Pro Apple4-Core A19 vs GPU Apple5-Core A19 Show 11 more

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