Apple 48-Core M1 Ultra vs Apple 32-Core M4 Max Full Specs

Summary

6,144 Shaders 1.3GHz	4,096 Shaders 1.58GHz
Shared Memory819.2GB/sLPDDR5	Shared Memory409.6GB/sLPDDR5X
Peak·FP32·FP16 15.93 TFLOPS	Peak·FP32·FP16 12.93 TFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 Memory Bandwidth

48-Core M1 Ultra15.93 TFLOPSFP16

x1.23

32-Core M4 Max12.93 TFLOPSFP16

x1

Show Top Score

Theoretical Performance

Clock Speed1296MHz UC·Boost·OC	Clock Speed1578MHz UC·Boost·OC
Peak OPS 15.93 TFLOPSFP16	Peak OPS 12.93 TFLOPSFP16
FP16 15.93 TFLOPS	FP16 12.93 TFLOPS
FP32 15.93 TFLOPS	FP32 12.93 TFLOPS
Pixel Rate 248.8 GPixel/s	Pixel Rate 202 GPixel/s
Texture Rate 497.7 GTexel/s	Texture Rate 404 GTexel/s

Core Config

Shaders 6,144 Shaders	Shaders 4,096 Shaders
TMUs 384 TMUs	TMUs 256 TMUs
ROPs 192 ROPs	ROPs 128 ROPs
RT Cores -	RT Cores 32 RT-Cores
EUs 768 EUs	EUs 512 EUs

Clocks

Boost Clock 1.3GHz

Boost Clock 1.58GHz

Cache

L2 Cache 8MB shared

L2 Cache 8MB shared

Memory

Shared MemoryLPDDR5	Shared MemoryLPDDR5X
Memory Bus 1024-bit	Memory Bus 384-bit
Memory Speed 6.4GT/s	Memory Speed 8.5GT/s
Memory Bandwidth 819.2GB/s	Memory Bandwidth 409.6GB/s
ECC No	ECC No

Video Output

Max Resolution 6016x3384	Max Resolution 7680x4320
Refresh Rate Calculator 6016x3384 Resolution6K Refresh Rate 60Hz	Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 120Hz
Multi-Monitor 5	Multi-Monitor 4
DSC Supported	DSC Supported

Encoder

Encoder 4x Apple Media Engine 2	Encoder 2x Apple Media Engine 3
Codec AVC (H.264) HEVC (H.265) ProRes	Codec AVC (H.264) HEVC (H.265) ProRes

Decoder

Decoder 2x Apple Media Engine 2	Decoder Apple Media Engine 3
Codec AVC (H.264) HEVC (H.265) - ProRes	Codec AVC (H.264) HEVC (H.265) AV1 ProRes

Card

Form Factor iGPU	Form Factor iGPU
Cooling Blower 2x Fans	Cooling Blower 2x Fans

Chip

Manufacturer Apple	Manufacturer Apple
Chip Designer Apple	Chip Designer Apple
Architecture Apple Gen 4	Architecture Apple Gen 7
Family M Series	Family M Series
Branding	Branding
Codename G13D	Codename G16C
Market Segment Workstation	Market Segment Laptop
Release Date Mar 8, 2022	Release Date Oct 30, 2024

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N5	Fabrication Node N3E
Die Size 865mm²	Die Size 454mm²
Transistor Count 114B	Transistor Count 76B
Transistor Density 132 MTr/mm²	Transistor Density 167 MTr/mm²

Images