Apple 5-Core A17 Pro vs Apple 80-Core M3 Ultra Full Specs

Summary

640 Shaders 1.34GHz	10,240 Shaders 1.38GHz
Shared Memory51.2GB/sLPDDR5	Shared Memory819.2GB/sLPDDR5
Peak·FP32·FP16 1.71 TFLOPS	Peak·FP32·FP16 28.26 TFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 Memory Bandwidth

5-Core A17 Pro1.71 TFLOPSFP16

x1

80-Core M3 Ultra28.26 TFLOPSFP16

x16.50

Show Top Score

Theoretical Performance

Clock Speed1338MHz UC·Boost·OC	Clock Speed1380MHz UC·Boost·OC
Peak OPS 1.71 TFLOPSFP16	Peak OPS 28.26 TFLOPSFP16
FP32 1.71 TFLOPS	FP32 28.26 TFLOPS
Pixel Rate 26.8 GPixel/s	Pixel Rate 441.6 GPixel/s
Texture Rate 53.5 GTexel/s	Texture Rate 883.2 GTexel/s

Core Config

Shaders 640 Shaders	Shaders 10,240 Shaders
TMUs 40 TMUs	TMUs 640 TMUs
ROPs 20 ROPs	ROPs 320 ROPs
RT Cores 5 RT-Cores	RT Cores 80 RT-Cores
EUs 80 EUs	EUs 1,280 EUs

Clocks

Boost Clock 1.34GHz

Boost Clock 1.38GHz

Cache

L2 Cache 768KB shared

L2 Cache 16MB shared

Memory

Shared MemoryLPDDR5	Shared MemoryLPDDR5
Memory Bus 64-bit	Memory Bus 1024-bit
Memory Speed 6.4GT/s	Memory Speed 6.4GT/s
Memory Bandwidth 51.2GB/s	Memory Bandwidth 819.2GB/s
ECC No	ECC No

Video Output

Max Resolution 3840x2160	Max Resolution 7680x4320
Refresh Rate Calculator 3840x2160 Resolution4K UHD Refresh Rate 60Hz	Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 60Hz
Multi-Monitor 1	Multi-Monitor 8
DSC Not Supported	DSC Supported

Encoder

Encoder Apple Media Engine 3	Encoder 4x Apple Media Engine 3
Codec AVC (H.264) HEVC (H.265) ProRes	Codec AVC (H.264) HEVC (H.265) ProRes

Decoder

Decoder Apple Media Engine 3	Decoder 2x Apple Media Engine 3
Codec AVC (H.264) HEVC (H.265) AV1 ProRes	Codec AVC (H.264) HEVC (H.265) AV1 ProRes

Card

Form Factor iGPU	Form Factor iGPU
Cooling Open-Air -	Cooling Blower 2x Fans

Chip

Manufacturer Apple	Manufacturer Apple
Chip Designer Apple	Chip Designer Apple
Architecture Apple Gen 6	Architecture Apple Gen 6
Family A Series	Family M Series
Branding	Branding
Codename G16P	Codename G15D
Market Segment Smartphone	Market Segment Workstation
Release Date Oct 15, 2024	Release Date Mar 5, 2025

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N3B	Fabrication Node N3B
Die Size 104mm²	Die Size 954mm²
Transistor Count 19B	Transistor Count 184B
Transistor Density 183 MTr/mm²	Transistor Density 193 MTr/mm²

Images