Apple 5-Core A18 Pro vs Apple 60-Core M3 Ultra Full Specs

Summary

640 Shaders 1.47GHz	7,680 Shaders 1.38GHz
Shared Memory60GB/sLPDDR5X	Shared Memory819.2GB/sLPDDR5
Peak·FP32·FP16 1.88 TFLOPS	Peak·FP32·FP16 21.2 TFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 Memory Bandwidth

5-Core A18 Pro1.88 TFLOPSFP16

x1

60-Core M3 Ultra21.2 TFLOPSFP16

x11.27

Show Top Score

Theoretical Performance

Clock Speed1470MHz UC·Boost·OC	Clock Speed1380MHz UC·Boost·OC
Peak OPS 1.88 TFLOPSFP16	Peak OPS 21.2 TFLOPSFP16
FP32 1.88 TFLOPS	FP32 21.2 TFLOPS
Pixel Rate 29.4 GPixel/s	Pixel Rate 331.2 GPixel/s
Texture Rate 58.8 GTexel/s	Texture Rate 662.4 GTexel/s

Core Config

Shaders 640 Shaders	Shaders 7,680 Shaders
TMUs 40 TMUs	TMUs 480 TMUs
ROPs 20 ROPs	ROPs 240 ROPs
RT Cores 5 RT-Cores	RT Cores 60 RT-Cores
EUs 80 EUs	EUs 960 EUs

Clocks

Boost Clock 1.47GHz

Boost Clock 1.38GHz

Cache

L2 Cache 768KB shared

L2 Cache 16MB shared

Memory

Shared MemoryLPDDR5X	Shared MemoryLPDDR5
Memory Bus 64-bit	Memory Bus 1024-bit
Memory Speed 7.5GT/s	Memory Speed 6.4GT/s
Memory Bandwidth 60GB/s	Memory Bandwidth 819.2GB/s
ECC No	ECC No

Video Output

Max Resolution 3840x2160	Max Resolution 7680x4320
Refresh Rate Calculator 3840x2160 Resolution4K UHD Refresh Rate 60Hz	Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 60Hz
Multi-Monitor 1	Multi-Monitor 8
DSC Not Supported	DSC Supported

Encoder

Encoder Apple Media Engine 3	Encoder 4x Apple Media Engine 3
Codec AVC (H.264) HEVC (H.265) ProRes	Codec AVC (H.264) HEVC (H.265) ProRes

Decoder

Decoder Apple Media Engine 3	Decoder 2x Apple Media Engine 3
Codec AVC (H.264) HEVC (H.265) AV1 ProRes	Codec AVC (H.264) HEVC (H.265) AV1 ProRes

Card

Form Factor iGPU	Form Factor iGPU
Cooling Open-Air -	Cooling Blower 2x Fans

Chip

Manufacturer Apple	Manufacturer Apple
Chip Designer Apple	Chip Designer Apple
Architecture Apple Gen 7	Architecture Apple Gen 6
Family A Series	Family M Series
Branding	Branding
Codename G17P	Codename G15D
Market Segment Smartphone	Market Segment Workstation
Release Date Mar 4, 2026	Release Date Mar 5, 2025

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N3E	Fabrication Node N3B
Die Size 110mm²	Die Size 954mm²
Transistor Count 18.4B	Transistor Count 184B
Transistor Density 168 MTr/mm²	Transistor Density 193 MTr/mm²

Images