Apple 6-Core A17 Pro vs Qualcomm Adreno 830 Full Specs

Summary

768 Shaders 1.34GHz	1,536 Shaders 1.1GHz
Shared Memory51.2GB/sLPDDR5	Shared Memory84.8GB/sLPDDR5X
Peak·FP32·FP16 2.06 TFLOPS	Peak·FP32·FP16 3.38 TFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP 5W

Theoretical Performance

Clock Speed1338MHz UC·Boost·OC	Clock Speed1100MHz UC·Boost·OC
Peak OPS 2.06 TFLOPSFP16	Peak OPS 6.76 TFLOPSFP16
-	BF16 6.76 TFLOPS
FP32 2.06 TFLOPS	FP32 3.38 TFLOPS
-	FP64 844.8 GFLOPS
Pixel Rate 32.1 GPixel/s	Pixel Rate 52.8 GPixel/s
Texture Rate 64.2 GTexel/s	Texture Rate 105.6 GTexel/s

Core Config

Shaders 768 Shaders	Shaders 1,536 Shaders
TMUs 48 TMUs	TMUs 96 TMUs
ROPs 24 ROPs	ROPs 48 ROPs
RT Cores 6 RT-Cores	RT Cores -
EUs 96 EUs	EUs 12 EUs

Clocks

Boost Clock 1.34GHz

Boost Clock 1.1GHz

Cache

L2 Cache 768KB shared	L2 Cache 1MB shared
L3 Cache -	L3 Cache 4MB shared

Memory

Shared MemoryLPDDR5	Shared MemoryLPDDR5X
Memory Bus 64-bit	Memory Bus 64-bit
Memory Speed 6.4GT/s	Memory Speed 10.6GT/s
Memory Bandwidth 51.2GB/s	Memory Bandwidth 84.8GB/s
ECC No	ECC No

Power & Thermals

TDP Shared

TDP 5W

Video Output

Max Resolution 3840x2160	Max Resolution 3840x2160
Refresh Rate Calculator 3840x2160 Resolution4K UHD Refresh Rate 60Hz	Refresh Rate Calculator 3840x2160 Resolution4K UHD Refresh Rate 60Hz
Multi-Monitor 1	Multi-Monitor 1
DSC Not Supported	DSC Not Supported

API Support

-	DirectX DirectX 12 Direct3D 12_1
-	OpenGL 3.2 OpenCL 2 Vulkan 1.3

Encoder

Encoder Apple Media Engine 3	Encoder Hexagon
Codec - - - - - AVC (H.264) HEVC (H.265) ProRes	Codec H.263 MPEG-4 VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) -

Decoder

Decoder Apple Media Engine 3	Decoder Hexagon AV1
Codec - - - - - - AVC (H.264) HEVC (H.265) AV1 ProRes	Codec MPEG-1 MPEG-2 MPEG-4 VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) AV1 -

Card

Form Factor iGPU

Form Factor iGPU

Chip

Manufacturer Apple	Manufacturer Qualcomm
Chip Designer Apple	Chip Designer Qualcomm
Architecture Apple Gen 6	Architecture Adreno 800
Family A Series	Family Adreno 800
Branding	Branding
Codename G16P	Codename -
Market Segment Smartphone	Market Segment Smartphone
Release Date Sep 12, 2023	Release Date Oct 1, 2024

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N3B	Fabrication Node N3E
Die Size 104mm²	Die Size 124mm²
Transistor Count 19B	Transistor Count -
Transistor Density 183 MTr/mm²	Transistor Density -

Images