Apple 60-Core M3 Ultra vs Intel HD 3000 1200MHz Full Specs

Summary

7,680 Shaders 1.38GHz	96 Shaders 1.2GHz
Shared Memory819.2GB/sLPDDR5	Shared Memory25.6GB/sDDR3
Peak·FP32·FP16 21.2 TFLOPS	Peak·FP32·FP16 230.4 GFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 Memory Bandwidth

60-Core M3 Ultra21.2 TFLOPSFP16

x92.00

HD 3000 1200MHz230.4 GFLOPSFP32

x1

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Theoretical Performance

Clock Speed1380MHz UC·Boost·OC	Clock Speed1200MHz UC·Base·Boost·OC
Peak OPS 21.2 TFLOPSFP16	Peak OPS 230.4 GFLOPSFP32
FP16 21.2 TFLOPS	-
FP32 21.2 TFLOPS	FP32 230.4 GFLOPS
Pixel Rate 331.2 GPixel/s	Pixel Rate 2.4 GPixel/s
Texture Rate 662.4 GTexel/s	Texture Rate 14.4 GTexel/s

Core Config

Shaders 7,680 Shaders	Shaders 96 Shaders
TMUs 480 TMUs	TMUs 12 TMUs
ROPs 240 ROPs	ROPs 2 ROPs
RT Cores 60 RT-Cores	RT Cores -
EUs 960 EUs	EUs 12 EUs

Clocks

Base Clock -	Base Clock 650MHz
Boost Clock 1.38GHz	Boost Clock 1.2GHz

Cache

L2 Cache 16MB shared

L2 Cache -

Memory

Shared MemoryLPDDR5	Shared MemoryDDR3
Memory Bus 1024-bit	Memory Bus 128-bit
Memory Speed 6.4GT/s	Memory Speed 1.6GT/s
Memory Bandwidth 819.2GB/s	Memory Bandwidth 25.6GB/s
ECC No	ECC No

Video Output

Max Resolution 7680x4320	Max Resolution 2560x1600
Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 60Hz	Refresh Rate Calculator 2560x1440 Resolution1440p QHD Refresh Rate 66Hz
Multi-Monitor 8	Multi-Monitor 2
DSC Supported	DSC Not Supported

API Support

Shader Model -	Shader Model 4.1
-	DirectX DirectX 11 Direct3D 10_1
-	OpenGL 3.1

Encoder

Encoder 4x Apple Media Engine 3	Encoder Quick Sync Video 1
Codec AVC (H.264) HEVC (H.265) ProRes	Codec AVC (H.264) - -

Decoder

Decoder 2x Apple Media Engine 3	Decoder Quick Sync Video 1
Codec - - - - AVC (H.264) HEVC (H.265) AV1 ProRes	Codec MPEG-1 MPEG-2 MPEG-4 VC-1 AVC (H.264) - - -

Card

Form Factor iGPU	Form Factor iGPU
Cooling Blower 2x Fans	Cooling Open-Air -

Chip

Manufacturer Apple	Manufacturer Intel
Chip Designer Apple	Chip Designer Intel
Architecture Apple Gen 6	Architecture Gen 6
Family M Series	Family Gen 6
Branding	Branding
Codename G15D	Codename Sandy Bridge
Chip Variant -	Chip Variant GT1
Market Segment Workstation	Market Segment Smartphone
Release Date Mar 5, 2025	Release Date Feb 1, 2011

Fabrication

Foundry TSMC	Foundry Intel
Fabrication Node N3B	Fabrication Node 32nm
Die Size 954mm²	Die Size 216mm²
Transistor Count 184B	Transistor Count 1.2B
Transistor Density 193 MTr/mm²	Transistor Density 5 MTr/mm²

Images