Apple 8-Core A12Z vs Intel UHD 32EU 850MHz Gen 11 Full Specs - HMC

512 Shaders 1.1GHz	256 Shaders 850MHz
Shared Memory68.3GB/sLPDDR4X	Shared Memory59.7GB/s ··
·· 1.12 TFLOPS	·· 435.2 GFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Clock Speed ··	Clock Speed ···
Peak OPS 1.12 TFLOPSFP16	Peak OPS 870.4 GFLOPSFP16
FP32 1.12 TFLOPS	FP32 435.2 GFLOPS
-	FP64 108.8 GFLOPS
Pixel Rate 17.6 GPixel/s	Pixel Rate 6.8 GPixel/s
Texture Rate 35.1 GTexel/s	Texture Rate 13.6 GTexel/s

Shaders 512 Shaders	Shaders 256 Shaders
TMUs 32 TMUs	TMUs 16 TMUs
ROPs 16 ROPs	ROPs 8 ROPs
EUs 64 EUs	EUs 32 EUs

Base Clock -	Base Clock 300MHz
Boost Clock 1.1GHz	Boost Clock 850MHz

L2 Cache

256KB shared

L2 Cache

-

Shared MemoryLPDDR4X	Shared Memory ··
Memory Bus 128-bit	Memory Bus 128-bit
Memory Speed 4.3GT/s	Memory Speed 3.7GT/s
Memory Bandwidth 68.3GB/s	Memory Bandwidth 59.7GB/s
ECC No	ECC No

Multi-Monitor

1

Multi-Monitor

4

-	Encoder Model Quick Sync Video 7
Codec -	Codec JPEG VP9 AVC (H.264) HEVC (H.265)

-	Decoder Model Quick Sync Video 7
Codec -	Codec MPEG-1 MPEG-2 MPEG-4 JPEG VC-1 VP8 VP9 AVC (H.264) HEVC (H.265)

Form Factor iGPU	Form Factor iGPU
Cooling Open-Air	Cooling Passive

Manufacturer Apple	Manufacturer Intel
Chip Designer Apple	Chip Designer Intel
Architecture Apple Gen 2	Architecture Gen 11
Family A Series	Family Gen 11
Branding	Branding
Codename G11G	Codename -
Chip Variant -	Chip Variant GT1
Market Segment Tablet	Market Segment Desktop
Release Date Mar 25, 2020	Release Date Jan 11, 2021

Foundry TSMC	Foundry Intel
Fabrication Node N7	Fabrication Node 10nm+
Die Size 135mm²	Die Size -
Transistor Count 10 Billion	Transistor Count -
Transistor Density 74 MTr/mm²	Transistor Density -