GPUs

Apple 8-Core M1 vs NVIDIA GeForce RTX 3050 Full Specs

1,024 Shaders
1.28GHz
2,560 Shaders
1.78GHz
Shared Memory68.3GB/sLPDDR4X
8GB GDDR6224GB/s
··
2.62 TFLOPS
··
9.1 TFLOPS
Form Factor
iGPU
Form Factor
PCIe Card
TDP
Shared
TDP
115W
Power Connectors
-
Power Connectors
1x 12-Pin

8-Core M18-Core M12.62 TFLOPSFP16
x1
GeForce RTX 3050GeForce RTX 3050291.1 TOPSINT4 Tensor Sparse
x111.24

Clock Speed
··
Clock Speed
···
Peak OPS
2.62 TFLOPSFP16
Peak OPS
291.1 TOPSINT4 Tensor Sparse
-
Tensor FP16-16
36.39 TFLOPS
FP16-16 Tensor Sparse
72.79 TFLOPS
Tensor FP16-32
18.2 TFLOPS
FP16-32 Tensor Sparse
36.39 TFLOPS
-
BF16
9.1 TFLOPS
Tensor BF16
18.2 TFLOPS
BF16 Tensor Sparse
36.39 TFLOPS
Tensor TF32
-
Tensor TF32
9.1 TFLOPS
FP32
2.62 TFLOPS
FP32
9.1 TFLOPS
-
FP64
142.2 GFLOPS
Tensor INT4
-
Tensor INT4
145.6 TOPS
-
Tensor INT8
72.79 TOPS
Ray
-
Ray
13.72 TOPS
Pixel Rate
40.9 GPixel/s
Pixel Rate
56.9 GPixel/s
Texture Rate
81.8 GTexel/s
Texture Rate
142.2 GTexel/s

Shaders
1,024 Shaders
Shaders
2,560 Shaders
TMUs
64 TMUs
TMUs
80 TMUs
ROPs
32 ROPs
ROPs
32 ROPs
Tensor Cores
-
Tensor Cores
80 T-Cores
RT Cores
-
RT Cores
20 RT-Cores
EUs
128 EUs
SMs
20 SMs

Base Clock
-
Base Clock
1.55GHz
Boost Clock
1.28GHz
Boost Clock
1.78GHz

L2 Cache
768KB shared
L2 Cache
2MB shared

Shared MemoryLPDDR4X
8GB GDDR6
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
4.3GT/s
Memory Speed
14GT/s
Memory Bandwidth
68.3GB/s
Memory Bandwidth
224GB/s
ECC
No
ECC
No

TDP
Shared
TDP
115W

Multi-Monitor
1
Multi-Monitor
3
HDCP
-
HDCP
HDCP 2.3

-
3x DisplayPort 1.4
-
1x HDMI 2.1

Encoder Model
Apple Media Engine 1
Encoder Model
NVENC 7

Decoder Model
Apple Media Engine 1
Decoder Model
NVDEC 5

Form Factor
iGPU
Form Factor
PCIe Card
PCIe
-
PCIe
1.9-Slots
-
Height
112 mm (4.41")
Width
242 mm (9.53")
Depth
38 mm (1.5")
Cooling
Open-Air
-
Cooling
Open-Air
2x Fans
Power Connectors
-
Power Connectors
1x 12-Pin

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
M1 branding
Branding
GeForce RTX 2018 branding
Codename
G13G
Codename
NV177
Chip Variant
-
Chip Variant
GA107-140-A1
Market Segment
Laptop
Market Segment
Desktop
Release Date
Nov 10, 2020
Release Date
Dec 16, 2022

Foundry
TSMC
Foundry
Samsung
Fabrication Node
N5
Fabrication Node
8N
Die Size
123mm²
Die Size
200mm²
Transistor Count
16 Billion
Transistor Count
8.7 Billion
Transistor Density
130 MTr/mm²
Transistor Density
43.5 MTr/mm²

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