GPUs

Apple 8-Core M4-FL vs Intel Arc 130V 1850MHz Full Specs

1,024 Shaders
1.58GHz
896 Shaders
1.85GHz
Shared Memory120GB/sLPDDR5X
Shared Memory136.5GB/sLPDDR5X
··
3.23 TFLOPS
··
3.31 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

8-Core M4-FL8-Core M4-FL3.23 TFLOPSFP16
x1
Arc 130V 1850MHzArc 130V 1850MHz106.1 TOPSINT4 Tensor
x32.83

Clock Speed
··
Clock Speed
··
Peak OPS
3.23 TFLOPSFP16
Peak OPS
106.1 TOPSINT4 Tensor
-
Tensor FP16-32
26.52 TFLOPS
-
Tensor BF16
26.52 TFLOPS
FP32
3.23 TFLOPS
FP32
3.31 TFLOPS
-
FP64
828.8 GFLOPS
Tensor INT4
-
Tensor INT4
106.1 TOPS
-
Tensor INT8
53.04 TOPS
Pixel Rate
50.5 GPixel/s
Pixel Rate
51.8 GPixel/s
Texture Rate
101 GTexel/s
Texture Rate
103.6 GTexel/s

Shaders
1,024 Shaders
Shaders
896 Shaders
TMUs
64 TMUs
TMUs
56 TMUs
ROPs
32 ROPs
ROPs
28 ROPs
Tensor Cores
-
Tensor Cores
56 T-Cores
RT Cores
8 RT-Cores
RT Cores
7 RT-Cores
EUs
128 EUs
EUs
56 EUs

Boost Clock
1.58GHz
Boost Clock
1.85GHz

L2 Cache
2MB shared
L2 Cache
7.2MB shared

Shared MemoryLPDDR5X
Shared MemoryLPDDR5X
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
7.5GT/s
Memory Speed
8.5GT/s
Memory Bandwidth
120GB/s
Memory Bandwidth
136.5GB/s
ECC
No
ECC
No

Multi-Monitor
2
Multi-Monitor
3

Encoder Model
Apple Media Engine 3
Encoder Model
Xe Media Engine

Decoder Model
Apple Media Engine 3
Decoder Model
Xe Media Engine

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
M4 FL branding
Branding
Arc branding
Codename
G16G
Codename
Xe2 LPG
Chip Variant
-
Chip Variant
GT2
Market Segment
Tablet
Market Segment
Laptop
Release Date
Mar 5, 2025
Release Date
Sep 3, 2024

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N3E
Fabrication Node
N3B
Die Size
169mm²
Die Size
140mm²
Transistor Count
28 Billion
Transistor Count
-
Transistor Density
165 MTr/mm²
Transistor Density
-

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