Apple 9-Core M3-FL vs Intel HD 667MHz Gen 5 Full Specs
1,152 Shaders 1.34GHz | 96 Shaders 667MHz |
Shared Memory102.4GB/sLPDDR5 | Shared Memory17.1GB/sDDR3 |
·· 3.08 TFLOPS | ·· 128.1 GFLOPS |
Form Factor iGPU | Form Factor iGPU |
TDP Shared | TDP Shared |
9-Core M3-FL3.08 TFLOPSFP16
HD 667MHz Gen 5128.1 GFLOPSFP32Clock Speed ·· | Clock Speed ··· |
Peak OPS 3.08 TFLOPSFP16 | Peak OPS 128.1 GFLOPSFP32 |
FP32 3.08 TFLOPS | FP32 128.1 GFLOPS |
Pixel Rate 48.2 GPixel/s | Pixel Rate 1.3 GPixel/s |
Texture Rate 96.3 GTexel/s | Texture Rate 10.7 GTexel/s |
Shaders 1,152 Shaders | Shaders 96 Shaders |
TMUs 72 TMUs | TMUs 16 TMUs |
ROPs 36 ROPs | ROPs 2 ROPs |
RT Cores 9 RT-Cores | RT Cores - |
EUs 144 EUs | EUs 12 EUs |
Base Clock - | Base Clock 500MHz |
Boost Clock 1.34GHz | Boost Clock 667MHz |
L2 Cache 2MB shared | L2 Cache - |
Shared MemoryLPDDR5 | Shared MemoryDDR3 |
Memory Bus 128-bit | Memory Bus 128-bit |
Memory Speed 6.4GT/s | Memory Speed 1.1GT/s |
Memory Bandwidth 102.4GB/s | Memory Bandwidth 17.1GB/s |
ECC No | ECC No |
Multi-Monitor 1 | Multi-Monitor 2 |
Encoder Model Apple Media Engine 3 | - |
Decoder Model Apple Media Engine 3 | - |
Form Factor iGPU | Form Factor iGPU |
Foundry TSMC | Foundry Intel |
Fabrication Node N3B | Fabrication Node 32nm |
Die Size 153mm² | Die Size 81mm² |
Transistor Count 25 Billion | Transistor Count 382 Million |
Transistor Density 164 MTr/mm² | Transistor Density 5 MTr/mm² |
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