GIGABYTE GeForce RTX 3050 OC Low Profile 6G vs NVIDIA GeForce GTX 460 768MB Full Specs
2,304 Shaders 1.48GHz | 336 Shaders 675MHz |
6GB GDDR6168GB/s | 786MB GDDR586.4GB/s |
·· 6.81 TFLOPS | ·· 907.2 GFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 70W | TDP 150W |
Power Connectors - | Power Connectors 2x 6-Pin |
Clock Speed ··· | Clock Speed ·· |
Peak OPS 217.8 TOPSINT4 Tensor Sparse | Peak OPS 907.2 GFLOPSFP32 |
Tensor FP16-16 27.22 TFLOPSFP16-16 Tensor Sparse 54.45 TFLOPSTensor FP16-32 13.61 TFLOPSFP16-32 Tensor Sparse 27.22 TFLOPS | - |
BF16 6.81 TFLOPSTensor BF16 13.61 TFLOPSBF16 Tensor Sparse 27.22 TFLOPS | - |
Tensor TF32 6.81 TFLOPS | Tensor TF32 - |
FP32 6.81 TFLOPS | FP32 907.2 GFLOPS |
FP64 106.3 GFLOPS | FP64 75.6 GFLOPS |
Tensor INT4 108.9 TOPS | Tensor INT4 - |
Tensor INT8 54.45 TOPS | - |
Ray 10.26 TOPS | Ray - |
Pixel Rate 47.3 GPixel/s | Pixel Rate 32.4 GPixel/s |
Texture Rate 106.3 GTexel/s | Texture Rate 75.6 GTexel/s |
Shaders 2,304 Shaders | Shaders 336 Shaders |
TMUs 72 TMUs | TMUs 56 TMUs |
ROPs 32 ROPs | ROPs 24 ROPs |
Tensor Cores 72 T-Cores | Tensor Cores - |
RT Cores 18 RT-Cores | RT Cores - |
SMs 18 SMs | SMs 7 SMs |
Base Clock 1.04GHz | Base Clock - |
Boost Clock 1.48GHz | Boost Clock 675MHz |
Shader Clock - | Shader Clock 1.35GHz |
L2 Cache 2MB shared | L2 Cache 512KB shared |
6GB GDDR6 | 786MB GDDR5 |
Memory Bus 96-bit | Memory Bus 192-bit |
Memory Speed 14GT/s | Memory Speed 3.6GT/s |
Memory Bandwidth 168GB/s | Memory Bandwidth 86.4GB/s |
ECC No | ECC No |
TDP 70W | TDP 150W |
Multi-Monitor 3 | Multi-Monitor 2 |
HDCP HDCP 2.3 | HDCP - |
2x DisplayPort 1.4 | - |
2x HDMI 2.1 | - |
- | 1x Mini HDMI 1.3 |
- | 2x DVI-I Dual-Link |
Encoder Model NVENC 7 | - |
Decoder Model NVDEC 5 | Decoder Model VP4 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 1.8-Slots | PCIe 2-Slots |
Height 69 mm (2.72")Width 181 mm (7.13")Depth 36 mm (1.42") | Height 111 mm (4.37")Width 210 mm (8.27")Depth 38 mm (1.5") |
Cooling Open-Air 2x Fans | Cooling Open-Air 1x Fan |
Power Connectors - | Power Connectors 2x 6-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename NV177 | Codename NVC4 |
Chip Variant GA107-140-A1 | Chip Variant GF104-225-A1 |
Market Segment Desktop | Market Segment Desktop |
Release Date Feb 2, 2024 | Release Date Jul 12, 2010 |
Foundry Samsung | Foundry TSMC |
Fabrication Node 8N | Fabrication Node 40nm |
Die Size 200mm² | Die Size 332mm² |
Transistor Count 8.7 Billion | Transistor Count 1.9 Billion |
Transistor Density 43.5 MTr/mm² | Transistor Density 5.87 MTr/mm² |
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