GPUs

GIGABYTE GeForce RTX 3050 OC Low Profile 6G vs NVIDIA NVS 310 Full Specs

2,304 Shaders
1.48GHz
48 Shaders
523MHz
6GB GDDR6168GB/s
524MB DDR314GB/s
··
6.81 TFLOPS
··
100.4 GFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
70W
TDP
20W

GeForce RTX 3050 OC Low Profile 6GGeForce RTX 3050 OC Low Profile 6G217.8 TOPSINT4 Tensor Sparse
x2168.90
NVS 310NVS 310100.4 GFLOPSFP32
x1

Clock Speed
···
Clock Speed
··
Peak OPS
217.8 TOPSINT4 Tensor Sparse
Peak OPS
100.4 GFLOPSFP32
Tensor FP16-16
27.22 TFLOPS
FP16-16 Tensor Sparse
54.45 TFLOPS
Tensor FP16-32
13.61 TFLOPS
FP16-32 Tensor Sparse
27.22 TFLOPS
-
BF16
6.81 TFLOPS
Tensor BF16
13.61 TFLOPS
BF16 Tensor Sparse
27.22 TFLOPS
-
Tensor TF32
6.81 TFLOPS
Tensor TF32
-
FP32
6.81 TFLOPS
FP32
100.4 GFLOPS
FP64
106.3 GFLOPS
FP64
8.37 GFLOPS
Tensor INT4
108.9 TOPS
Tensor INT4
-
Tensor INT8
54.45 TOPS
-
Ray
10.26 TOPS
Ray
-
Pixel Rate
47.3 GPixel/s
Pixel Rate
4.2 GPixel/s
Texture Rate
106.3 GTexel/s
Texture Rate
8.4 GTexel/s

Shaders
2,304 Shaders
Shaders
48 Shaders
TMUs
72 TMUs
TMUs
8 TMUs
ROPs
32 ROPs
ROPs
4 ROPs
Tensor Cores
72 T-Cores
Tensor Cores
-
RT Cores
18 RT-Cores
RT Cores
-
SMs
18 SMs
SM
1 SM

Base Clock
1.04GHz
Base Clock
-
Boost Clock
1.48GHz
Boost Clock
523MHz
Shader Clock
-
Shader Clock
1.05GHz

L2 Cache
2MB shared
L2 Cache
128KB shared

6GB GDDR6
524MB DDR3
Memory Bus
96-bit
Memory Bus
64-bit
Memory Speed
14GT/s
Memory Speed
1.8GT/s
Memory Bandwidth
168GB/s
Memory Bandwidth
14GB/s

TDP
70W
TDP
20W

Multi-Monitor
3
Multi-Monitor
2
HDCP
HDCP 2.3
HDCP
-

2x DisplayPort 1.4
-
-
2x DisplayPort 1.0
2x HDMI 2.1
-

Encoder Model
NVENC 7
-

Decoder Model
NVDEC 5
Decoder Model
VP5

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
1.8-Slots
PCIe
1-Slots
Height
69 mm (2.72")
Width
181 mm (7.13")
Depth
36 mm (1.42")
Height
69 mm (2.72")
Width
145 mm (5.71")
Depth
20 mm (0.79")
Cooling
Open-Air
2x Fans
Cooling
Open-Air
1x Fan

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
GeForce RTX 2018 branding
Branding
NVS branding
Codename
NV177
Codename
NVD9
Chip Variant
GA107-140-A1
Chip Variant
-
Market Segment
Desktop
Market Segment
Workstation
Release Date
Feb 2, 2024
Release Date
Jun 26, 2012

Foundry
Samsung
Foundry
TSMC
Fabrication Node
8N
Fabrication Node
40nm
Die Size
200mm²
Die Size
79mm²
Transistor Count
8.7 Billion
Transistor Count
292 Million
Transistor Density
43.5 MTr/mm²
Transistor Density
3.7 MTr/mm²

No images available
No images available