GIGABYTE GeForce RTX 3050 OC Low Profile 6G vs NVIDIA Quadro FX 380 Full Specs
2,304 Shaders 1.48GHz | 16 Shaders 450MHz |
6GB GDDR6168GB/s | 262MB GDDR322.4GB/s |
·· 6.81 TFLOPS | ·· 35.2 GFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 70W | TDP 34W |
GeForce RTX 3050 OC Low Profile 6G217.8 TOPSINT4 Tensor Sparse
Quadro FX 38035.2 GFLOPSFP32Clock Speed ··· | Clock Speed ·· |
Peak OPS 217.8 TOPSINT4 Tensor Sparse | Peak OPS 35.2 GFLOPSFP32 |
Tensor FP16-16 27.22 TFLOPSFP16-16 Tensor Sparse 54.45 TFLOPSTensor FP16-32 13.61 TFLOPSFP16-32 Tensor Sparse 27.22 TFLOPS | - |
BF16 6.81 TFLOPSTensor BF16 13.61 TFLOPSBF16 Tensor Sparse 27.22 TFLOPS | - |
Tensor TF32 6.81 TFLOPS | Tensor TF32 - |
FP32 6.81 TFLOPS | FP32 35.2 GFLOPS |
FP64 106.3 GFLOPS | - |
Tensor INT4 108.9 TOPS | Tensor INT4 - |
Tensor INT8 54.45 TOPS | - |
Ray 10.26 TOPS | Ray - |
Pixel Rate 47.3 GPixel/s | Pixel Rate 8.8 GPixel/s |
Texture Rate 106.3 GTexel/s | Texture Rate 8.8 GTexel/s |
Shaders 2,304 Shaders | Shaders 16 Shaders |
TMUs 72 TMUs | TMUs 8 TMUs |
ROPs 32 ROPs | ROPs 8 ROPs |
Tensor Cores 72 T-Cores | Tensor Cores - |
RT Cores 18 RT-Cores | RT Cores - |
SMs 18 SMs | SMs 2 SMs |
Base Clock 1.04GHz | Base Clock - |
Boost Clock 1.48GHz | Boost Clock 450MHz |
Shader Clock - | Shader Clock 1.1GHz |
L2 Cache 2MB shared | L2 Cache 32KB shared |
6GB GDDR6 | 262MB GDDR3 |
Memory Bus 96-bit | Memory Bus 128-bit |
Memory Speed 14GT/s | Memory Speed 1.4GT/s |
Memory Bandwidth 168GB/s | Memory Bandwidth 22.4GB/s |
ECC No | ECC No |
TDP 70W | TDP 34W |
Multi-Monitor 3 | Multi-Monitor 2 |
HDCP HDCP 2.3 | HDCP - |
2x DisplayPort 1.4 | - |
2x HDMI 2.1 | - |
- | 2x DVI-I Dual-Link |
Encoder Model NVENC 7 | - |
Decoder Model NVDEC 5 | Decoder Model VP3 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 1.8-Slots | PCIe 1-Slots |
Height 69 mm (2.72")Width 181 mm (7.13")Depth 36 mm (1.42") | Height 111 mm (4.37")Width 198 mm (7.79")Depth 20 mm (0.79") |
Cooling Open-Air 2x Fans | Cooling Blower 1x Fan |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename NV177 | Codename NV96 |
Chip Variant GA107-140-A1 | Chip Variant G96-300-C1 |
Market Segment Desktop | Market Segment Workstation |
Release Date Feb 2, 2024 | Release Date Mar 30, 2009 |
Foundry Samsung | Foundry UMC |
Fabrication Node 8N | Fabrication Node 65nm |
Die Size 200mm² | Die Size 144mm² |
Transistor Count 8.7 Billion | Transistor Count 314 Million |
Transistor Density 43.5 MTr/mm² | Transistor Density 2.18 MTr/mm² |
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