Intel Arc 130V 1850MHz

Arc 130V 1850MHz

Apple 10-Core M3

10-Core M3

Intel Arc 130V 1850MHz vs Apple 10-Core M3 Full Specs

896 Shaders
1.85GHz
1,280 Shaders
1.34GHz
Shared Memory136.5GB/sLPDDR5X
Shared Memory102.4GB/sLPDDR5
··
3.31 TFLOPS
··
3.42 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

Arc 130V 1850MHzArc 130V 1850MHz106.1 TOPSINT4 Tensor
x30.97
10-Core M310-Core M33.42 TFLOPSFP16
x1

Clock Speed
··
Clock Speed
··
Peak OPS
106.1 TOPSINT4 Tensor
Peak OPS
3.42 TFLOPSFP16
Tensor FP16-32
26.52 TFLOPS
-
Tensor BF16
26.52 TFLOPS
-
FP32
3.31 TFLOPS
FP32
3.42 TFLOPS
FP64
828.8 GFLOPS
-
Tensor INT4
106.1 TOPS
Tensor INT4
-
Tensor INT8
53.04 TOPS
-
Pixel Rate
51.8 GPixel/s
Pixel Rate
53.5 GPixel/s
Texture Rate
103.6 GTexel/s
Texture Rate
107 GTexel/s

Shaders
896 Shaders
Shaders
1,280 Shaders
TMUs
56 TMUs
TMUs
80 TMUs
ROPs
28 ROPs
ROPs
40 ROPs
Tensor Cores
56 T-Cores
Tensor Cores
-
RT Cores
7 RT-Cores
RT Cores
10 RT-Cores
EUs
56 EUs
EUs
160 EUs

Boost Clock
1.85GHz
Boost Clock
1.34GHz

L1
192KB/SM
L1
-
L2 Cache
7MB shared
L2 Cache
2MB shared

Shared MemoryLPDDR5X
Shared MemoryLPDDR5
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
8.5GT/s
Memory Speed
6.4GT/s
Memory Bandwidth
136.5GB/s
Memory Bandwidth
102.4GB/s
ECC
No
ECC
No

Max Resolution
7680x4320
Max Resolution
7680x4320
Refresh Rate Calculator
7680x4320
Resolution8K UHD
Refresh Rate
60Hz
Refresh Rate Calculator
7680x4320
Resolution8K UHD
Refresh Rate
60Hz
Multi-Monitor
3
Multi-Monitor
1
DSC
Supported
DSC
Supported

Shader Model
6.4
Shader Model
-
DirectX
DirectX 12
Direct3D
12_2
-
OpenGL
4.6
OpenCL
3
Vulkan
1.2
-

Encoder
Xe Media Engine
Encoder
Apple Media Engine 3
Codec
VP9
AVC (H.264)
HEVC (H.265)
AV1
-
Codec
-
AVC (H.264)
HEVC (H.265)
-
ProRes

Decoder
Xe Media Engine
Decoder
Apple Media Engine 3
Codec
MPEG-2
JPEG
VC-1
VP8
VP9
AVC (H.264)
HEVC (H.265)
VVC (H.266)
AV1
-
Codec
-
-
-
-
-
AVC (H.264)
HEVC (H.265)
-
AV1
ProRes

Form Factor
iGPU
Form Factor
iGPU
Cooling
Open-Air
-
Cooling
Blower
1x Fan

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Arc branding
Branding
M3 branding
Codename
Xe2 LPG
Codename
G15G
Chip Variant
GT2
Chip Variant
-
Market Segment
Laptop
Market Segment
Laptop
Release Date
Sep 3, 2024
Release Date
Oct 30, 2023

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N3B
Fabrication Node
N3B
Die Size
140mm²
Die Size
153mm²
Transistor Count
-
Transistor Count
25B
Transistor Density
-
Transistor Density
164 MTr/mm²