GPUs

Intel Arc 130V 1850MHz vs Apple 30-Core M2 Max Full Specs

896 Shaders
1.85GHz
3,840 Shaders
1.4GHz
Shared Memory136.5GB/sLPDDR5X
Shared Memory409.6GB/sLPDDR5
··
3.31 TFLOPS
··
10.74 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

Arc 130V 1850MHzArc 130V 1850MHz106.1 TOPSINT4 Tensor
x9.88
30-Core M2 Max30-Core M2 Max10.74 TFLOPSFP16
x1

Clock Speed
··
Clock Speed
··
Peak OPS
106.1 TOPSINT4 Tensor
Peak OPS
10.74 TFLOPSFP16
Tensor FP16-32
26.52 TFLOPS
-
Tensor BF16
26.52 TFLOPS
-
FP32
3.31 TFLOPS
FP32
10.74 TFLOPS
FP64
828.8 GFLOPS
-
Tensor INT4
106.1 TOPS
Tensor INT4
-
Tensor INT8
53.04 TOPS
-
Pixel Rate
51.8 GPixel/s
Pixel Rate
167.8 GPixel/s
Texture Rate
103.6 GTexel/s
Texture Rate
335.5 GTexel/s

Shaders
896 Shaders
Shaders
3,840 Shaders
TMUs
56 TMUs
TMUs
240 TMUs
ROPs
28 ROPs
ROPs
120 ROPs
Tensor Cores
56 T-Cores
Tensor Cores
-
RT Cores
7 RT-Cores
RT Cores
-
EUs
56 EUs
EUs
480 EUs

Boost Clock
1.85GHz
Boost Clock
1.4GHz

L2 Cache
7.2MB shared
L2 Cache
8.2MB shared

Shared MemoryLPDDR5X
Shared MemoryLPDDR5
Memory Bus
128-bit
Memory Bus
512-bit
Memory Speed
8.5GT/s
Memory Speed
6.4GT/s
Memory Bandwidth
136.5GB/s
Memory Bandwidth
409.6GB/s

Multi-Monitor
3
Multi-Monitor
4

Encoder Model
Xe Media Engine
Encoder Model
2x Apple Media Engine 2

Decoder Model
Xe Media Engine
Decoder Model
Apple Media Engine 2

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Arc branding
Branding
M2 Max branding
Codename
Xe2 LPG
Codename
G14C
Chip Variant
GT2
Chip Variant
-
Market Segment
Laptop
Market Segment
Desktop
Release Date
Sep 3, 2024
Release Date
Jan 17, 2023

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N3B
Fabrication Node
N5P
Die Size
140mm²
Die Size
486mm²
Transistor Count
-
Transistor Count
67 Billion
Transistor Density
-
Transistor Density
138 MTr/mm²

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