Intel Arc 130V 1850MHz vs NVIDIA GeForce RTX 3070 Ti Laptop 125W Full Specs
896 Shaders 1.85GHz | 5,888 Shaders 1.49GHz |
Shared Memory136.5GB/sLPDDR5X | 8GB GDDR6448GB/s placeholder |
·· 3.31 TFLOPS | ·· 17.49 TFLOPS |
Form Factor iGPU | Form Factor Soldered |
TDP Shared | TDP 125W |
Clock Speed ·· | Clock Speed ··· |
Peak OPS 106.1 TOPSINT4 Tensor | Peak OPS 559.6 TOPSINT4 Tensor Sparse |
Tensor FP16-16 -FP16-16 Tensor Sparse -Tensor FP16-32 26.52 TFLOPSFP16-32 Tensor Sparse - | Tensor FP16-16 69.95 TFLOPSFP16-16 Tensor Sparse 139.9 TFLOPSTensor FP16-32 34.97 TFLOPSFP16-32 Tensor Sparse 69.95 TFLOPS |
BF16 -Tensor BF16 26.52 TFLOPSBF16 Tensor Sparse - | BF16 17.49 TFLOPSTensor BF16 34.97 TFLOPSBF16 Tensor Sparse 69.95 TFLOPS |
Tensor TF32 - | Tensor TF32 17.49 TFLOPS |
FP32 3.31 TFLOPS | FP32 17.49 TFLOPS |
FP64 828.8 GFLOPS | FP64 273.2 GFLOPS |
Tensor INT4 106.1 TOPS | Tensor INT4 279.8 TOPS |
Tensor INT8 53.04 TOPS | Tensor INT8 139.9 TOPS |
Ray - | Ray 26.37 TOPS |
Pixel Rate 51.8 GPixel/s | Pixel Rate 142.6 GPixel/s |
Texture Rate 103.6 GTexel/s | Texture Rate 273.2 GTexel/s |
Shaders 896 Shaders | Shaders 5,888 Shaders |
TMUs 56 TMUs | TMUs 184 TMUs |
ROPs 28 ROPs | ROPs 96 ROPs |
Tensor Cores 56 T-Cores | Tensor Cores 184 T-Cores |
RT Cores 7 RT-Cores | RT Cores 46 RT-Cores |
EUs 56 EUs | SMs 46 SMs |
Base Clock - | Base Clock 1.03GHz |
Boost Clock 1.85GHz | Boost Clock 1.49GHz |
L2 Cache 7MB shared | L2 Cache 4MB shared |
Shared MemoryLPDDR5X | 8GB GDDR6 placeholder |
Memory Bus 128-bit | Memory Bus 256-bit |
Memory Speed 8.5GT/s | Memory Speed 14GT/s |
Memory Bandwidth 136.5GB/s | Memory Bandwidth 448GB/s |
ECC No | ECC No |
TDP Shared | TDP 125W |
Multi-Monitor 3 | Multi-Monitor 3 |
HDCP - | HDCP HDCP 2.3 |
Encoder Model Xe Media Engine | Encoder Model NVENC 7 |
Codec VP9 AVC (H.264) HEVC (H.265) AV1 | Codec - AVC (H.264) HEVC (H.265) - |
Decoder Model Xe Media Engine | Decoder Model NVDEC 5 |
Codec - MPEG-2 - JPEG VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) VVC (H.266) AV1 | Codec MPEG-1 MPEG-2 MPEG-4 - VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) - AV1 |
Form Factor iGPU | Form Factor Soldered |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Xe2 LPG | Codename NV174 |
Chip Variant GT2 | Chip Variant GA104-150-A1 |
Market Segment Laptop | Market Segment Laptop |
Release Date Sep 3, 2024 | Release Date Jan 12, 2021 |
Foundry TSMC | Foundry Samsung |
Fabrication Node N3B | Fabrication Node 8N |
Die Size 140mm² | Die Size 393mm² |
Transistor Count - | Transistor Count 17.4 Billion |
Transistor Density - | Transistor Density 44.33 MTr/mm² |

