Intel Arc 140V 2050MHz vs Apple 10-Core M5 Full Specs

Summary

1,024 Shaders 2.05GHz	1,280 Shaders 1.62GHz
Shared Memory136.5GB/sLPDDR5X	Shared Memory153.6GB/sLPDDR5X
Peak·FP32·FP16 4.2 TFLOPS	Peak·FP32·FP16 4.15 TFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP8-16 Tensor FP8-32 Tensor FP16-16 Tensor FP16-32 FP64 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth

Arc 140V 2050MHz134.3 TOPSINT4 Tensor

x16.20

10-Core M58.29 TFLOPSFP8-16 Tensor

x1

Show Top Score

Theoretical Performance

Clock Speed2050MHz UC·Boost·OC	Clock Speed1620MHz UC·Boost·OC
Peak OPS 134.3 TOPSINT4 Tensor	Peak OPS 8.29 TFLOPSFP8-16 Tensor
-	Tensor FP8-16 8.29 TFLOPS Tensor FP8-32 8.29 TFLOPS
Tensor FP16-16 - Tensor FP16-32 33.59 TFLOPS	Tensor FP16-16 4.15 TFLOPS Tensor FP16-32 4.15 TFLOPS
Tensor BF16 33.59 TFLOPS	-
FP32 4.2 TFLOPS	FP32 4.15 TFLOPS
FP64 1.05 TFLOPS	-
Tensor INT4 134.3 TOPS	Tensor INT4 -
Tensor INT8 67.17 TOPS	-
Pixel Rate 65.6 GPixel/s	Pixel Rate 64.8 GPixel/s
Texture Rate 131.2 GTexel/s	Texture Rate 129.6 GTexel/s

Core Config

Shaders 1,024 Shaders	Shaders 1,280 Shaders
TMUs 64 TMUs	TMUs 80 TMUs
ROPs 32 ROPs	ROPs 40 ROPs
Tensor Cores 64 T-Cores	Tensor Cores 10 T-Cores
RT Cores 8 RT-Cores	RT Cores 10 RT-Cores
EUs 64 EUs	EUs 160 EUs

Clocks

Boost Clock 2.05GHz

Boost Clock 1.62GHz

Cache

L2 Cache 8.2MB shared

L2 Cache 2MB shared

Memory

Shared MemoryLPDDR5X	Shared MemoryLPDDR5X
Memory Bus 128-bit	Memory Bus 128-bit
Memory Speed 8.5GT/s	Memory Speed 9.6GT/s
Memory Bandwidth 136.5GB/s	Memory Bandwidth 153.6GB/s

Video Output

Multi-Monitor 3

Multi-Monitor 2

Encoder

Encoder Model Xe Media Engine

Encoder Model Apple Media Engine 3

Decoder

Decoder Model Xe Media Engine

Decoder Model Apple Media Engine 3

Card

Form Factor iGPU

Form Factor iGPU

Chip

Manufacturer Intel	Manufacturer Apple
Chip Designer Intel	Chip Designer Apple
Architecture Battlemage	Architecture Apple Gen 8
Family Gen 13	Family M Series
Branding	Branding
Codename Xe2 LPG	Codename G17G
Chip Variant GT2	Chip Variant -
Market Segment Laptop	Market Segment Laptop
Release Date Sep 3, 2024	Release Date Oct 15, 2025

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N3B	Fabrication Node N3P
Die Size 140mm²	Die Size -

Images

No images available

No images available

Used In

CPUs Core Ultra 9 288V	CPUs M5 (10C10G)
Laptops XPS 13(9350, Late 2024)	Laptops MacBook Pro 14(M5, Late 2025)

Competitors

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