Intel Arc B390 2500MHz vs Qualcomm Adreno X2-90 7.6T Full Specs

Summary

1,536 Shaders 2.5GHz	2,048 Shaders 1.85GHz
Shared Memory153.6GB/sLPDDR5X	Shared Memory228.6GB/sLPDDR5X
Peak·FP32·FP16 7.68 TFLOPS	Peak·FP32·FP16 7.58 TFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP 15W

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 BF16 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

Arc B390 2500MHz245.8 TOPSINT4 Tensor

x16.22

Adreno X2-90 7.6T15.16 TFLOPSFP16

x1

Show Top Score

Theoretical Performance

Clock Speed2500MHz UC·Boost·OC	Clock Speed1850MHz UC·Boost·OC
Peak OPS 245.8 TOPSINT4 Tensor	Peak OPS 15.16 TFLOPSFP16
Tensor FP16-32 61.44 TFLOPS	-
BF16 - Tensor BF16 61.44 TFLOPS	BF16 15.16 TFLOPS Tensor BF16 -
FP32 7.68 TFLOPS	FP32 7.58 TFLOPS
FP64 1.92 TFLOPS	FP64 1.89 TFLOPS
Tensor INT4 245.8 TOPS	Tensor INT4 -
Tensor INT8 122.9 TOPS	-
Pixel Rate 120 GPixel/s	Pixel Rate 118.4 GPixel/s
Texture Rate 240 GTexel/s	Texture Rate 236.8 GTexel/s

Core Config

Shaders 1,536 Shaders	Shaders 2,048 Shaders
TMUs 96 TMUs	TMUs 128 TMUs
ROPs 48 ROPs	ROPs 64 ROPs
Tensor Cores 96 T-Cores	Tensor Cores -
RT Cores 12 RT-Cores	RT Cores -
EUs 96 EUs	EUs 16 EUs

Clocks

Boost Clock 2.5GHz

Boost Clock 1.85GHz

Cache

L2 Cache 16.4MB shared	L2 Cache 2MB shared
L3 Cache -	L3 Cache 21MB shared

Memory

Shared MemoryLPDDR5X	Shared MemoryLPDDR5X
Memory Bus 128-bit	Memory Bus 192-bit
Memory Speed 9.6GT/s	Memory Speed 9.5GT/s
Memory Bandwidth 153.6GB/s	Memory Bandwidth 228.6GB/s

Power & Thermals

TDP Shared

TDP 15W

Video Output

Multi-Monitor 3

Multi-Monitor 3

Encoder

Encoder Model Xe Media Engine

Encoder Model Hexagon AV1

Decoder

Decoder Model Xe Media Engine

Decoder Model Hexagon AV1

Card

Form Factor iGPU

Form Factor iGPU

Chip

Manufacturer Intel	Manufacturer Qualcomm
Chip Designer Intel	Chip Designer Qualcomm
Architecture Battlemage	Architecture Adreno X
Family Gen 13	Family Adreno X
Branding	Branding
Codename Xe3 LPG	Codename -
Chip Variant GT1	Chip Variant -
Market Segment Laptop	Market Segment Laptop
Release Date Jan 5, 2026	Release Date Sep 24, 2025

Fabrication

Foundry Intel	Foundry TSMC
Fabrication Node Intel 3	Fabrication Node N3E
Die Size 27mm²	Die Size 288mm²

Images

No images available

No images available

Used In

CPUs Core Ultra X7 358H Core Ultra X7 368H Core Ultra X9 388H

CPUs Snapdragon X2 Elite Extreme (X2E-96-100)

Competitors

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