Intel Arc B570 Full Specs
2,304 Shaders 2.5GHz |
10GB GDDR6380GB/s |
·· 11.52 TFLOPS |
Form Factor PCIe Card |
TDP 150W |
Power Connectors 1x 8-Pin |
Clock Speed ·· |
Peak OPS 368.6 TOPSINT4 Tensor |
Tensor FP16-32 92.16 TFLOPS |
Tensor BF16 92.16 TFLOPS |
FP32 11.52 TFLOPS |
FP64 2.88 TFLOPS |
Tensor INT4 368.6 TOPS |
Tensor INT8 184.3 TOPS |
Pixel Rate 180 GPixel/s |
Texture Rate 360 GTexel/s |
Shaders 2,304 Shaders |
TMUs 144 TMUs |
ROPs 72 ROPs |
Tensor Cores 144 T-Cores |
RT Cores 18 RT-Cores |
EUs 144 EUs |
Boost Clock 2.5GHz |
L2 Cache 18.4MB shared |
10GB GDDR6 |
Memory Bus 160-bit |
Memory Speed 19GT/s |
Memory Bandwidth 380GB/s |
TDP 150W |
Multi-Monitor 4 |
3x DisplayPort 2.1 |
1x HDMI 2.1 |
Encoder Model Arc |
Decoder Model Arc |
Form Factor PCIe Card |
PCIe 2-Slots |
Height 115 mm (4.53")Width 272 mm (10.71")Depth 40 mm (1.57") |
Cooling Open-Air 2x Fans |
Power Connectors 1x 8-Pin |
Manufacturer |
Chip Designer |
Architecture |
Family |
Branding  |
Codename Xe2 HPG |
Market Segment Desktop |
Release Date Dec 3, 2024 |
Foundry TSMC |
Fabrication Node N5 |
Die Size 272mm² |
Transistor Count 19.6 Billion |
Transistor Density 72.06 MTr/mm² |
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