Intel Arc B580 vs NVIDIA GeForce RTX 3060 8GB Full Specs
2,560 Shaders 2.67GHz | 3,584 Shaders 1.78GHz |
12GB GDDR6456GB/s | 8GB GDDR6240GB/s |
·· 13.67 TFLOPS | ·· 12.74 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 190W | TDP 170W |
Power Connectors - 1x 8-Pin | Power Connectors 1x 12-Pin - |
Clock Speed ·· | Clock Speed ··· |
Peak OPS 437.5 TOPSINT4 Tensor | Peak OPS 407.6 TOPSINT4 Tensor Sparse |
Tensor FP16-16 -FP16-16 Tensor Sparse -Tensor FP16-32 109.4 TFLOPSFP16-32 Tensor Sparse - | Tensor FP16-16 50.95 TFLOPSFP16-16 Tensor Sparse 101.9 TFLOPSTensor FP16-32 25.48 TFLOPSFP16-32 Tensor Sparse 50.95 TFLOPS |
BF16 -Tensor BF16 109.4 TFLOPSBF16 Tensor Sparse - | BF16 12.74 TFLOPSTensor BF16 25.48 TFLOPSBF16 Tensor Sparse 50.95 TFLOPS |
Tensor TF32 - | Tensor TF32 12.74 TFLOPS |
FP32 13.67 TFLOPS | FP32 12.74 TFLOPS |
FP64 3.42 TFLOPS | FP64 199 GFLOPS |
Tensor INT4 437.5 TOPS | Tensor INT4 203.8 TOPS |
Tensor INT8 218.7 TOPS | Tensor INT8 101.9 TOPS |
Ray - | Ray 19.21 TOPS |
Pixel Rate 213.6 GPixel/s | Pixel Rate 85.3 GPixel/s |
Texture Rate 427.2 GTexel/s | Texture Rate 199 GTexel/s |
Shaders 2,560 Shaders | Shaders 3,584 Shaders |
TMUs 160 TMUs | TMUs 112 TMUs |
ROPs 80 ROPs | ROPs 48 ROPs |
Tensor Cores 160 T-Cores | Tensor Cores 112 T-Cores |
RT Cores 20 RT-Cores | RT Cores 28 RT-Cores |
EUs 160 EUs | SMs 28 SMs |
Base Clock - | Base Clock 1.32GHz |
Boost Clock 2.67GHz | Boost Clock 1.78GHz |
L2 Cache 18.4MB shared | L2 Cache 2MB shared |
12GB GDDR6 | 8GB GDDR6 |
Memory Bus 192-bit | Memory Bus 128-bit |
Memory Speed 19GT/s | Memory Speed 15GT/s |
Memory Bandwidth 456GB/s | Memory Bandwidth 240GB/s |
TDP 190W | TDP 170W |
Multi-Monitor 4 | Multi-Monitor 3 |
HDCP - | HDCP HDCP 2.3 |
3x DisplayPort 2.1 | - |
- | 3x DisplayPort 1.4 |
1x HDMI 2.1 | 1x HDMI 2.1 |
Encoder Model Arc | Encoder Model NVENC 7 |
Decoder Model Arc | Decoder Model NVDEC 5 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe - |
Height 115 mm (4.53")Width 272 mm (10.71")Depth 40 mm (1.57") | - |
Cooling Open-Air 2x Fans | Cooling Open-Air 2x Fans |
Power Connectors 1x 8-Pin | Power Connectors 1x 12-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Xe2 HPG | Codename NV176 |
Chip Variant - | Chip Variant GA106-150-KA-A1 |
Market Segment Desktop | Market Segment Desktop |
Release Date Dec 3, 2024 | Release Date Oct 27, 2022 |
Foundry TSMC | Foundry Samsung |
Fabrication Node N5 | Fabrication Node 8N |
Die Size 272mm² | Die Size 276mm² |
Transistor Count 19.6 Billion | Transistor Count 13.3 Billion |
Transistor Density 72.06 MTr/mm² | Transistor Density 48.01 MTr/mm² |
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