Intel Graphics 2C 2300MHz vs NVIDIA Quadro 3000M Full Specs

Summary

256 Shaders 2.3GHz	240 Shaders 450MHz
Shared Memory119.5GB/s LPDDR5X·DDR5	2GB GDDR580GB/s placeholder
Peak·FP32·FP16 1.18 TFLOPS	Peak·FP32·FP16 432 GFLOPS
Form Factor iGPU	Form Factor Soldered
TDP Shared	TDP 75W

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

Graphics 2C 2300MHz37.68 TOPSINT4 Tensor

x87.23

Quadro 3000M432 GFLOPSFP32

x1

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Theoretical Performance

Clock Speed2300MHz UC·Boost·OC	Clock Speed450MHz UC·Boost·OC
Peak OPS 37.68 TOPSINT4 Tensor	Peak OPS 432 GFLOPSFP32
Tensor FP16-32 9.42 TFLOPS	-
Tensor BF16 9.42 TFLOPS	-
FP32 1.18 TFLOPS	FP32 432 GFLOPS
FP64 294.4 GFLOPS	FP64 36 GFLOPS
Tensor INT4 37.68 TOPS	Tensor INT4 -
Tensor INT8 18.84 TOPS	-
Pixel Rate 18.4 GPixel/s	Pixel Rate 28.8 GPixel/s
Texture Rate 36.8 GTexel/s	Texture Rate 36 GTexel/s

Core Config

Shaders 256 Shaders	Shaders 240 Shaders
TMUs 16 TMUs	TMUs 40 TMUs
ROPs 8 ROPs	ROPs 32 ROPs
Tensor Cores 16 T-Cores	Tensor Cores -
RT Cores 2 RT-Cores	RT Cores -
EUs 16 EUs	SMs 5 SMs

Clocks

Boost Clock 2.3GHz	Boost Clock 450MHz
Shader Clock -	Shader Clock 900MHz

Cache

L2 Cache 4.1MB shared

L2 Cache 512KB shared

Memory

Shared Memory LPDDR5X·DDR5	2GB GDDR5 placeholder
Memory Bus 128-bit	Memory Bus 256-bit
Memory Speed 7.5GT/s	Memory Speed 2.5GT/s
Memory Bandwidth 119.5GB/s	Memory Bandwidth 80GB/s
ECC No	ECC No

Power & Thermals

TDP Shared

TDP 75W

Video Output

Multi-Monitor 3

Multi-Monitor 2

Encoder

Encoder Model Xe Media Engine

-

Decoder

Decoder Model Xe Media Engine

Decoder Model VP4

Card

Form Factor iGPU

Form Factor Soldered

Chip

Manufacturer Intel	Manufacturer NVIDIA
Chip Designer Intel	Chip Designer NVIDIA
Architecture Battlemage	Architecture Fermi
Family Gen 13	Family Quadro F
Branding	Branding
Codename Xe3 LPG	Codename NVC4
Chip Variant GT1	Chip Variant GF104-225-A1
Market Segment Laptop	Market Segment Laptop
Release Date Jan 5, 2026	Release Date Feb 22, 2011

Fabrication

Foundry Intel	Foundry TSMC
Fabrication Node Intel 3	Fabrication Node 40nm
Die Size 27mm²	Die Size 332mm²
Transistor Count -	Transistor Count 1.9 Billion
Transistor Density -	Transistor Density 5.87 MTr/mm²

Images

No images available

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Used In

CPUs Core Ultra 5 322 Core Ultra 5 332

CPUs -

Competitors

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