Intel Graphics 4C 2300MHz vs NVIDIA GeForce GTX 950M GDDR5 Full Specs

Summary

512 Shaders 2.3GHz	640 Shaders 914MHz
Shared Memory136.5GB/s LPDDR5X·DDR5	2GB GDDR580GB/s placeholder
Peak·FP32·FP16 2.35 TFLOPS	Peak·FP32·FP16 1.17 TFLOPS
Form Factor iGPU	Form Factor Soldered
TDP Shared	TDP -

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth

Graphics 4C 2300MHz75.37 TOPSINT4 Tensor

x64.42

GeForce GTX 950M GDDR51.17 TFLOPSFP32

x1

Show Top Score

Theoretical Performance

Clock Speed2300MHz UC·Boost·OC	Clock Speed914MHz UC·Boost·OC
Peak OPS 75.37 TOPSINT4 Tensor	Peak OPS 1.17 TFLOPSFP32
Tensor FP16-32 18.84 TFLOPS	-
Tensor BF16 18.84 TFLOPS	-
FP32 2.35 TFLOPS	FP32 1.17 TFLOPS
FP64 588.8 GFLOPS	FP64 36.56 GFLOPS
Tensor INT4 75.37 TOPS	Tensor INT4 -
Tensor INT8 37.68 TOPS	-
Pixel Rate 36.8 GPixel/s	Pixel Rate 14.6 GPixel/s
Texture Rate 73.6 GTexel/s	Texture Rate 36.6 GTexel/s

Core Config

Shaders 512 Shaders	Shaders 640 Shaders
TMUs 32 TMUs	TMUs 40 TMUs
ROPs 16 ROPs	ROPs 16 ROPs
Tensor Cores 32 T-Cores	Tensor Cores -
RT Cores 4 RT-Cores	RT Cores -
EUs 32 EUs	SMs 5 SMs

Clocks

Boost Clock 2.3GHz

Boost Clock 914MHz

Cache

L2 Cache 4.1MB shared

L2 Cache 2MB shared

Memory

Shared Memory LPDDR5X·DDR5	2GB GDDR5 placeholder
Memory Bus 128-bit	Memory Bus 128-bit
Memory Speed 8.5GT/s	Memory Speed 5GT/s
Memory Bandwidth 136.5GB/s	Memory Bandwidth 80GB/s
ECC No	ECC No

Video Output

Multi-Monitor 3

Multi-Monitor 2

Encoder

Encoder Model Xe Media Engine

Encoder Model NVENC 2

Decoder

Decoder Model Xe Media Engine

Decoder Model NVDEC 1

Card

Form Factor iGPU

Form Factor Soldered

Chip

Manufacturer Intel	Manufacturer NVIDIA
Chip Designer Intel	Chip Designer NVIDIA
Architecture Battlemage	Architecture Maxwell
Family Gen 13	Family GeForce 900
Branding	Branding
Codename Xe3 LPG	Codename NV117
Chip Variant GT1	Chip Variant GM107-220-A2
Market Segment Laptop	Market Segment Laptop
Release Date Jan 5, 2026	Release Date Mar 12, 2015

Fabrication

Foundry Intel	Foundry TSMC
Fabrication Node Intel 3	Fabrication Node 28nm
Die Size 27mm²	Die Size 148mm²
Transistor Count -	Transistor Count 1.9 Billion
Transistor Density -	Transistor Density 12.64 MTr/mm²

Images

No images available

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Used In

CPUs Core Ultra 5 336H

CPUs -

Competitors

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