Intel Graphics 4C 2300MHz vs NVIDIA Quadro P1000 Laptop Full Specs

Summary

512 Shaders 2.3GHz	512 Shaders 1.52GHz
Shared Memory136.5GB/s LPDDR5X·DDR5	4GB GDDR596GB/s placeholder
Peak·FP32·FP16 2.35 TFLOPS	Peak·FP32·FP16 1.55 TFLOPS
Form Factor iGPU	Form Factor Soldered
TDP Shared	TDP 40W

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

Graphics 4C 2300MHz75.37 TOPSINT4 Tensor

x48.45

Quadro P1000 Laptop1.55 TFLOPSFP32

x1

Show Top Score

Theoretical Performance

Clock Speed2300MHz UC·Boost·OC	Clock Speed1519MHz UC·Base·Boost·OC
Peak OPS 75.37 TOPSINT4 Tensor	Peak OPS 1.55 TFLOPSFP32
Tensor FP16-32 18.84 TFLOPS	-
Tensor BF16 18.84 TFLOPS	-
FP32 2.35 TFLOPS	FP32 1.55 TFLOPS
FP64 588.8 GFLOPS	FP64 48.61 GFLOPS
Tensor INT4 75.37 TOPS	Tensor INT4 -
Tensor INT8 37.68 TOPS	-
Pixel Rate 36.8 GPixel/s	Pixel Rate 24.3 GPixel/s
Texture Rate 73.6 GTexel/s	Texture Rate 48.6 GTexel/s

Core Config

Shaders 512 Shaders	Shaders 512 Shaders
TMUs 32 TMUs	TMUs 32 TMUs
ROPs 16 ROPs	ROPs 16 ROPs
Tensor Cores 32 T-Cores	Tensor Cores -
RT Cores 4 RT-Cores	RT Cores -
EUs 32 EUs	SMs 4 SMs

Clocks

Base Clock -	Base Clock 1.49GHz
Boost Clock 2.3GHz	Boost Clock 1.52GHz

Cache

L2 Cache 4.1MB shared

L2 Cache 768KB shared

Memory

Shared Memory LPDDR5X·DDR5	4GB GDDR5 placeholder
Memory Bus 128-bit	Memory Bus 128-bit
Memory Speed 8.5GT/s	Memory Speed 6GT/s
Memory Bandwidth 136.5GB/s	Memory Bandwidth 96GB/s
ECC No	ECC No

Power & Thermals

TDP Shared

TDP 40W

Video Output

Multi-Monitor 3

Multi-Monitor 3

Encoder

Encoder Model Xe Media Engine

Encoder Model NVENC 4

Decoder

Decoder Model Xe Media Engine

Decoder Model NVDEC 3

Card

Form Factor iGPU

Form Factor Soldered

Chip

Manufacturer Intel	Manufacturer NVIDIA
Chip Designer Intel	Chip Designer NVIDIA
Architecture Battlemage	Architecture Pascal
Family Gen 13	Family Quadro P
Branding	Branding
Codename Xe3 LPG	Codename NV137
Chip Variant GT1	Chip Variant GP107-300-A1
Market Segment Laptop	Market Segment Laptop
Release Date Jan 5, 2026	Release Date Feb 7, 2017

Fabrication

Foundry Intel	Foundry Samsung
Fabrication Node Intel 3	Fabrication Node 14LPP
Die Size 27mm²	Die Size 132mm²
Transistor Count -	Transistor Count 3.3 Billion
Transistor Density -	Transistor Density 25 MTr/mm²

Images

No images available

No images available

Used In

CPUs Core Ultra 5 336H

CPUs -

Competitors

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