Intel Graphics 4C 2450MHz vs NVIDIA GeForce GTX 960M Full Specs

Summary

512 Shaders 2.45GHz	640 Shaders 1.18GHz
Shared Memory136.5GB/s LPDDR5X·DDR5	2GB GDDR580GB/s placeholder
Peak·FP32·FP16 2.51 TFLOPS	Peak·FP32·FP16 1.5 TFLOPS
Form Factor iGPU	Form Factor Soldered
TDP Shared	TDP 65W

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

Graphics 4C 2450MHz80.28 TOPSINT4 Tensor

x53.33

GeForce GTX 960M1.5 TFLOPSFP32

x1

Show Top Score

Theoretical Performance

Clock Speed2450MHz UC·Boost·OC	Clock Speed1176MHz UC·Base·Boost·OC
Peak OPS 80.28 TOPSINT4 Tensor	Peak OPS 1.5 TFLOPSFP32
Tensor FP16-32 20.07 TFLOPS	-
Tensor BF16 20.07 TFLOPS	-
FP32 2.51 TFLOPS	FP32 1.5 TFLOPS
FP64 627.2 GFLOPS	FP64 47.04 GFLOPS
Tensor INT4 80.28 TOPS	Tensor INT4 -
Tensor INT8 40.14 TOPS	-
Pixel Rate 39.2 GPixel/s	Pixel Rate 18.8 GPixel/s
Texture Rate 78.4 GTexel/s	Texture Rate 47 GTexel/s

Core Config

Shaders 512 Shaders	Shaders 640 Shaders
TMUs 32 TMUs	TMUs 40 TMUs
ROPs 16 ROPs	ROPs 16 ROPs
Tensor Cores 32 T-Cores	Tensor Cores -
RT Cores 4 RT-Cores	RT Cores -
EUs 32 EUs	SMs 5 SMs

Clocks

Base Clock -	Base Clock 1.1GHz
Boost Clock 2.45GHz	Boost Clock 1.18GHz

Cache

L2 Cache 4.1MB shared

L2 Cache 2MB shared

Memory

Shared Memory LPDDR5X·DDR5	2GB GDDR5 placeholder
Memory Bus 128-bit	Memory Bus 128-bit
Memory Speed 8.5GT/s	Memory Speed 5GT/s
Memory Bandwidth 136.5GB/s	Memory Bandwidth 80GB/s
ECC No	ECC No

Power & Thermals

TDP Shared

TDP 65W

Video Output

Multi-Monitor 3

Multi-Monitor 2

Encoder

Encoder Model Xe Media Engine

Encoder Model NVENC 2

Decoder

Decoder Model Xe Media Engine

Decoder Model NVDEC 1

Card

Form Factor iGPU

Form Factor Soldered

Chip

Manufacturer Intel	Manufacturer NVIDIA
Chip Designer Intel	Chip Designer NVIDIA
Architecture Battlemage	Architecture Maxwell
Family Gen 13	Family GeForce 900
Branding	Branding
Codename Xe3 LPG	Codename NV117
Chip Variant GT1	Chip Variant GM107-220-A2
Market Segment Laptop	Market Segment Laptop
Release Date Jan 5, 2026	Release Date Mar 12, 2015

Fabrication

Foundry Intel	Foundry TSMC
Fabrication Node Intel 3	Fabrication Node 28nm
Die Size 27mm²	Die Size 148mm²
Transistor Count -	Transistor Count 1.9 Billion
Transistor Density -	Transistor Density 12.64 MTr/mm²

Images

No images available

No images available

Used In

CPUs Core Ultra 5 325 Core Ultra 5 335 Core Ultra 7 356H	CPUs -
Laptops -	Laptops Blade Pro 17(Early 2015)

Competitors

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