Intel HD 1150MHz Gen 6 vs Intel HD 850MHz Gen 7 Full Specs

Summary

48 Shaders 1.15GHz	80 Shaders 850MHz
Shared Memory21.3GB/sDDR3	Shared Memory25.6GB/s DDR3·DDR3L·LPDDR3
Peak·FP32·FP16 110.4 GFLOPS	Peak·FP32·FP16 136 GFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Theoretical Performance

Clock Speed1150MHz UC·Base·Boost·OC	Clock Speed850MHz UC·Base·Boost·OC
Peak OPS 110.4 GFLOPSFP32	Peak OPS 136 GFLOPSFP32
FP32 110.4 GFLOPS	FP32 136 GFLOPS
-	FP64 34 GFLOPS
Pixel Rate 1.1 GPixel/s	Pixel Rate 0.8 GPixel/s
Texture Rate 6.9 GTexel/s	Texture Rate 8.5 GTexel/s

Core Config

Shaders 48 Shaders	Shaders 80 Shaders
TMUs 6 TMUs	TMUs 10 TMUs
ROPs 1 ROP	ROPs 1 ROP
EUs 6 EUs	EUs 10 EUs

Clocks

Base Clock 350MHz	Base Clock 200MHz
Boost Clock 1.15GHz	Boost Clock 850MHz

Memory

Shared MemoryDDR3	Shared Memory DDR3·DDR3L·LPDDR3
Memory Bus 128-bit	Memory Bus 128-bit
Memory Speed 1.3GT/s	Memory Speed 1.6GT/s
Memory Bandwidth 21.3GB/s	Memory Bandwidth 25.6GB/s
ECC No	ECC No

Video Output

Multi-Monitor 2

Multi-Monitor 2

Encoder

-	Encoder Model Quick Sync Video 3
Codec -	Codec AVC (H.264)

Decoder

-	Decoder Model Quick Sync Video 3
Codec -	Codec MPEG-1 MPEG-2 MPEG-4 JPEG VC-1 AVC (H.264)

Card

Form Factor iGPU

Form Factor iGPU

Chip

Manufacturer Intel	Manufacturer Intel
Chip Designer Intel	Chip Designer Intel
Architecture Gen 6	Architecture Gen 7
Family Gen 6	Family Gen 7
Branding	Branding
Codename Sandy Bridge	Codename Haswell
Chip Variant GT1	Chip Variant GT1
Market Segment Smartphone	Market Segment Laptop
Release Date Feb 1, 2011	Release Date Apr 29, 2013

Fabrication

Foundry Intel	Foundry Intel
Fabrication Node 32nm	Fabrication Node 22nm
Die Size 131mm²	Die Size 131mm²
Transistor Count 504 Million	Transistor Count 960 Million
Transistor Density 4 MTr/mm²	Transistor Density 7 MTr/mm²

Images