Intel HD 3000 1200MHz vs Apple 32-Core M4 Max Full Specs

Summary

96 Shaders 1.2GHz	4,096 Shaders 1.58GHz
Shared Memory25.6GB/sDDR3	Shared Memory409.6GB/sLPDDR5X
Peak·FP32·FP16 230.4 GFLOPS	Peak·FP32·FP16 12.93 TFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 Memory Bandwidth

HD 3000 1200MHz230.4 GFLOPSFP32

x1

32-Core M4 Max12.93 TFLOPSFP16

x56.11

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Theoretical Performance

Clock Speed1200MHz UC·Base·Boost·OC	Clock Speed1578MHz UC·Boost·OC
Peak OPS 230.4 GFLOPSFP32	Peak OPS 12.93 TFLOPSFP16
-	FP16 12.93 TFLOPS
FP32 230.4 GFLOPS	FP32 12.93 TFLOPS
Pixel Rate 2.4 GPixel/s	Pixel Rate 202 GPixel/s
Texture Rate 14.4 GTexel/s	Texture Rate 404 GTexel/s

Core Config

Shaders 96 Shaders	Shaders 4,096 Shaders
TMUs 12 TMUs	TMUs 256 TMUs
ROPs 2 ROPs	ROPs 128 ROPs
RT Cores -	RT Cores 32 RT-Cores
EUs 12 EUs	EUs 512 EUs

Clocks

Base Clock 650MHz	Base Clock -
Boost Clock 1.2GHz	Boost Clock 1.58GHz

Cache

L2 Cache -

L2 Cache 8MB shared

Memory

Shared MemoryDDR3	Shared MemoryLPDDR5X
Memory Bus 128-bit	Memory Bus 384-bit
Memory Speed 1.6GT/s	Memory Speed 8.5GT/s
Memory Bandwidth 25.6GB/s	Memory Bandwidth 409.6GB/s
ECC No	ECC No

Video Output

Max Resolution 2560x1600	Max Resolution 7680x4320
Refresh Rate Calculator 2560x1440 Resolution1440p QHD Refresh Rate 66Hz	Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 120Hz
Multi-Monitor 2	Multi-Monitor 4
DSC Not Supported	DSC Supported

API Support

Shader Model 4.1	Shader Model -
DirectX DirectX 11 Direct3D 10_1	-
OpenGL 3.1	-

Encoder

Encoder Quick Sync Video 1	Encoder 2x Apple Media Engine 3
Codec AVC (H.264) - -	Codec AVC (H.264) HEVC (H.265) ProRes

Decoder

Decoder Quick Sync Video 1	Decoder Apple Media Engine 3
Codec MPEG-1 MPEG-2 MPEG-4 VC-1 AVC (H.264) - - -	Codec - - - - AVC (H.264) HEVC (H.265) AV1 ProRes

Card

Form Factor iGPU	Form Factor iGPU
Cooling Open-Air -	Cooling Blower 2x Fans

Chip

Manufacturer Intel	Manufacturer Apple
Chip Designer Intel	Chip Designer Apple
Architecture Gen 6	Architecture Apple Gen 7
Family Gen 6	Family M Series
Branding	Branding
Codename Sandy Bridge	Codename G16C
Chip Variant GT1	Chip Variant -
Market Segment Smartphone	Market Segment Laptop
Release Date Feb 1, 2011	Release Date Oct 30, 2024

Fabrication

Foundry Intel	Foundry TSMC
Fabrication Node 32nm	Fabrication Node N3E
Die Size 216mm²	Die Size 454mm²
Transistor Count 1.2B	Transistor Count 76B
Transistor Density 5 MTr/mm²	Transistor Density 167 MTr/mm²

Images