Intel HD 3000 1200MHz

HD 3000 1200MHz

Apple 60-Core M3 Ultra

60-Core M3 Ultra

Intel HD 3000 1200MHz vs Apple 60-Core M3 Ultra Full Specs

96 Shaders
1.2GHz
7,680 Shaders
1.38GHz
Shared Memory25.6GB/sDDR3
Shared Memory819.2GB/sLPDDR5
··
230.4 GFLOPS
··
21.2 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

HD 3000 1200MHzHD 3000 1200MHz230.4 GFLOPSFP32
x1
60-Core M3 Ultra60-Core M3 Ultra21.2 TFLOPSFP16
x92.00

Clock Speed
···
Clock Speed
··
Peak OPS
230.4 GFLOPSFP32
Peak OPS
21.2 TFLOPSFP16
-
FP16
21.2 TFLOPS
FP32
230.4 GFLOPS
FP32
21.2 TFLOPS
Pixel Rate
2.4 GPixel/s
Pixel Rate
331.2 GPixel/s
Texture Rate
14.4 GTexel/s
Texture Rate
662.4 GTexel/s

Shaders
96 Shaders
Shaders
7,680 Shaders
TMUs
12 TMUs
TMUs
480 TMUs
ROPs
2 ROPs
ROPs
240 ROPs
RT Cores
-
RT Cores
60 RT-Cores
EUs
12 EUs
EUs
960 EUs

Base Clock
650MHz
Base Clock
-
Boost Clock
1.2GHz
Boost Clock
1.38GHz

L2 Cache
-
L2 Cache
16MB shared

Shared MemoryDDR3
Shared MemoryLPDDR5
Memory Bus
128-bit
Memory Bus
1024-bit
Memory Speed
1.6GT/s
Memory Speed
6.4GT/s
Memory Bandwidth
25.6GB/s
Memory Bandwidth
819.2GB/s
ECC
No
ECC
No

Max Resolution
2560x1600
Max Resolution
7680x4320
Refresh Rate Calculator
2560x1440
Resolution1440p QHD
Refresh Rate
66Hz
Refresh Rate Calculator
7680x4320
Resolution8K UHD
Refresh Rate
60Hz
Multi-Monitor
2
Multi-Monitor
8
DSC
Not Supported
DSC
Supported

Shader Model
4.1
Shader Model
-
DirectX
DirectX 11
Direct3D
10_1
-
OpenGL
3.1
-

Encoder
Quick Sync Video 1
Encoder
4x Apple Media Engine 3
Codec
AVC (H.264)
-
-
Codec
AVC (H.264)
HEVC (H.265)
ProRes

Decoder
Quick Sync Video 1
Decoder
2x Apple Media Engine 3
Codec
MPEG-1
MPEG-2
MPEG-4
VC-1
AVC (H.264)
-
-
-
Codec
-
-
-
-
AVC (H.264)
HEVC (H.265)
AV1
ProRes

Form Factor
iGPU
Form Factor
iGPU
Cooling
Open-Air
-
Cooling
Blower
2x Fans

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
HD 2011 branding
Branding
M3 Ultra branding
Codename
Sandy Bridge
Codename
G15D
Chip Variant
GT1
Chip Variant
-
Market Segment
Smartphone
Market Segment
Workstation
Release Date
Feb 1, 2011
Release Date
Mar 5, 2025

Foundry
Intel
Foundry
TSMC
Fabrication Node
32nm
Fabrication Node
N3B
Die Size
216mm²
Die Size
954mm²
Transistor Count
1.2B
Transistor Count
184B
Transistor Density
5 MTr/mm²
Transistor Density
193 MTr/mm²