Intel HD 3000 1200MHz vs Apple 60-Core M3 Ultra Full Specs
96 Shaders 1.2GHz | 7,680 Shaders 1.38GHz |
Shared Memory25.6GB/sDDR3 | Shared Memory819.2GB/sLPDDR5 |
·· 230.4 GFLOPS | ·· 21.2 TFLOPS |
Form Factor iGPU | Form Factor iGPU |
TDP Shared | TDP Shared |
Clock Speed ··· | Clock Speed ·· |
Peak OPS 230.4 GFLOPSFP32 | Peak OPS 21.2 TFLOPSFP16 |
- | FP16 21.2 TFLOPS |
FP32 230.4 GFLOPS | FP32 21.2 TFLOPS |
Pixel Rate 2.4 GPixel/s | Pixel Rate 331.2 GPixel/s |
Texture Rate 14.4 GTexel/s | Texture Rate 662.4 GTexel/s |
Shaders 96 Shaders | Shaders 7,680 Shaders |
TMUs 12 TMUs | TMUs 480 TMUs |
ROPs 2 ROPs | ROPs 240 ROPs |
RT Cores - | RT Cores 60 RT-Cores |
EUs 12 EUs | EUs 960 EUs |
Base Clock 650MHz | Base Clock - |
Boost Clock 1.2GHz | Boost Clock 1.38GHz |
L2 Cache - | L2 Cache 16MB shared |
Shared MemoryDDR3 | Shared MemoryLPDDR5 |
Memory Bus 128-bit | Memory Bus 1024-bit |
Memory Speed 1.6GT/s | Memory Speed 6.4GT/s |
Memory Bandwidth 25.6GB/s | Memory Bandwidth 819.2GB/s |
ECC No | ECC No |
Max Resolution 2560x1600 | Max Resolution 7680x4320 |
Refresh Rate Calculator 2560x1440 Resolution1440p QHD Refresh Rate 66Hz | Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 60Hz |
Multi-Monitor 2 | Multi-Monitor 8 |
DSC Not Supported | DSC Supported |
Shader Model 4.1 | Shader Model - |
DirectX DirectX 11Direct3D 10_1 | - |
OpenGL 3.1 | - |
Encoder Quick Sync Video 1 | Encoder 4x Apple Media Engine 3 |
Codec AVC (H.264) - - | Codec AVC (H.264) HEVC (H.265) ProRes |
Decoder Quick Sync Video 1 | Decoder 2x Apple Media Engine 3 |
Codec MPEG-1 MPEG-2 MPEG-4 VC-1 AVC (H.264) - - - | Codec - - - - AVC (H.264) HEVC (H.265) AV1 ProRes |
Form Factor iGPU | Form Factor iGPU |
Cooling Open-Air - | Cooling Blower 2x Fans |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Sandy Bridge | Codename G15D |
Chip Variant GT1 | Chip Variant - |
Market Segment Smartphone | Market Segment Workstation |
Release Date Feb 1, 2011 | Release Date Mar 5, 2025 |
Foundry Intel | Foundry TSMC |
Fabrication Node 32nm | Fabrication Node N3B |
Die Size 216mm² | Die Size 954mm² |
Transistor Count 1.2B | Transistor Count 184B |
Transistor Density 5 MTr/mm² | Transistor Density 193 MTr/mm² |





