Intel HD 530 950MHz vs Intel HD 4600 1200MHz Full Specs

Summary

192 Shaders 950MHz	160 Shaders 1.2GHz
Shared Memory34.1GB/s DDR4·LPDDR3·DDR3L	Shared Memory25.6GB/s DDR3·DDR3L
Peak·FP32·FP16 364.8 GFLOPS	Peak·FP32·FP16 384 GFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Theoretical Performance

Clock Speed950MHz UC·Base·Boost·OC	Clock Speed1200MHz UC·Base·Boost·OC
Peak OPS 364.8 GFLOPSFP32	Peak OPS 384 GFLOPSFP32
FP32 364.8 GFLOPS	FP32 384 GFLOPS
FP64 91.2 GFLOPS	FP64 96 GFLOPS
Pixel Rate 2.9 GPixel/s	Pixel Rate 2.4 GPixel/s
Texture Rate 22.8 GTexel/s	Texture Rate 24 GTexel/s

Core Config

Shaders 192 Shaders	Shaders 160 Shaders
TMUs 24 TMUs	TMUs 20 TMUs
ROPs 3 ROPs	ROPs 2 ROPs
EUs 24 EUs	EUs 20 EUs

Clocks

Base Clock 350MHz	Base Clock 350MHz
Boost Clock 950MHz	Boost Clock 1.2GHz

Memory

Shared Memory DDR4·LPDDR3·DDR3L	Shared Memory DDR3·DDR3L
Memory Bus 128-bit	Memory Bus 128-bit
Memory Speed 2.1GT/s	Memory Speed 1.6GT/s
Memory Bandwidth 34.1GB/s	Memory Bandwidth 25.6GB/s
ECC No	ECC No

Video Output

Multi-Monitor 3

Multi-Monitor 2

Encoder

Encoder Model Quick Sync Video 5	Encoder Model Quick Sync Video 3
Codec JPEG AVC (H.264) HEVC (H.265)	Codec - AVC (H.264) -

Decoder

Decoder Model Quick Sync Video 5	Decoder Model Quick Sync Video 3
Codec MPEG-1 MPEG-2 MPEG-4 JPEG VC-1 VP8 AVC (H.264) HEVC (H.265)	Codec MPEG-1 MPEG-2 MPEG-4 JPEG VC-1 - AVC (H.264) -

Card

Form Factor iGPU	Form Factor iGPU
Cooling Open-Air	Cooling Passive

Chip

Manufacturer Intel	Manufacturer Intel
Chip Designer Intel	Chip Designer Intel
Architecture Gen 9	Architecture Gen 7
Family Gen 9	Family Gen 7
Branding	Branding
Codename Skylake	Codename Haswell
Chip Variant GT1	Chip Variant GT1
Market Segment Laptop	Market Segment Desktop
Release Date Sep 1, 2015	Release Date Sep 3, 2013

Fabrication

Foundry Intel	Foundry Intel
Fabrication Node 14nm	Fabrication Node 22nm
Die Size 122mm²	Die Size 177mm²
Transistor Count 2.1 Billion	Transistor Count 1.4 Billion
Transistor Density 17 MTr/mm²	Transistor Density 8 MTr/mm²

Images