Intel Iris Pro 5200 1150MHz vs Intel Graphics 2C 2300MHz Full Specs

Summary

320 Shaders 1.15GHz	256 Shaders 2.3GHz
Shared Memory25.6GB/s DDR3·DDR3L	Shared Memory119.5GB/s LPDDR5X·DDR5
Peak·FP32·FP16 736 GFLOPS	Peak·FP32·FP16 1.18 TFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth

Iris Pro 5200 1150MHz736 GFLOPSFP32

x1

Graphics 2C 2300MHz37.68 TOPSINT4 Tensor

x51.20

Show Top Score

Theoretical Performance

Clock Speed1150MHz UC·Base·Boost·OC	Clock Speed2300MHz UC·Boost·OC
Peak OPS 736 GFLOPSFP32	Peak OPS 37.68 TOPSINT4 Tensor
-	Tensor FP16-32 9.42 TFLOPS
-	Tensor BF16 9.42 TFLOPS
FP32 736 GFLOPS	FP32 1.18 TFLOPS
FP64 184 GFLOPS	FP64 294.4 GFLOPS
Tensor INT4 -	Tensor INT4 37.68 TOPS
-	Tensor INT8 18.84 TOPS
Pixel Rate 4.6 GPixel/s	Pixel Rate 18.4 GPixel/s
Texture Rate 46 GTexel/s	Texture Rate 36.8 GTexel/s

Core Config

Shaders 320 Shaders	Shaders 256 Shaders
TMUs 40 TMUs	TMUs 16 TMUs
ROPs 4 ROPs	ROPs 8 ROPs
Tensor Cores -	Tensor Cores 16 T-Cores
RT Cores -	RT Cores 2 RT-Cores
EUs 40 EUs	EUs 16 EUs

Clocks

Base Clock 200MHz	Base Clock -
Boost Clock 1.15GHz	Boost Clock 2.3GHz

Cache

L2 Cache -

L2 Cache 4.1MB shared

Memory

Shared Memory DDR3·DDR3L	Shared Memory LPDDR5X·DDR5
Memory Bus 128-bit	Memory Bus 128-bit
Memory Speed 1.6GT/s	Memory Speed 7.5GT/s
Memory Bandwidth 25.6GB/s	Memory Bandwidth 119.5GB/s
EDRAM 128MBSize 128BitBus Width 100GB/sBandwidth	EDRAM -

Video Output

Multi-Monitor 2

Multi-Monitor 3

Encoder

Encoder Model Quick Sync Video 3

Encoder Model Xe Media Engine

Decoder

Decoder Model Quick Sync Video 3

Decoder Model Xe Media Engine

Card

Form Factor iGPU	Form Factor iGPU
Cooling Passive	Cooling Open-Air

Chip

Manufacturer Intel	Manufacturer Intel
Chip Designer Intel	Chip Designer Intel
Architecture Gen 7	Architecture Battlemage
Family Gen 7	Family Gen 13
Branding	Branding
Codename Haswell	Codename Xe3 LPG
Chip Variant GT1	Chip Variant GT1
Market Segment Desktop	Market Segment Laptop
Release Date May 27, 2013	Release Date Jan 5, 2026

Fabrication

Foundry Intel	Foundry Intel
Fabrication Node 22nm	Fabrication Node Intel 3
Die Size 260mm²	Die Size 27mm²
Transistor Count 1.7 Billion	Transistor Count -
Transistor Density 7 MTr/mm²	Transistor Density -

Images

No images available

No images available

Used In

CPUs Core i5-4570R	CPUs Core Ultra 5 322 Core Ultra 5 332
All-in-Ones iMac 21.5(Late 2013)	All-in-Ones -

Competitors

IntelIris Pro 5200 1150MHz vs GPU QualcommAdreno 722

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