Intel Iris Pro 5200 1150MHz vs NVIDIA GeForce GTX 1060 Full Specs
320 Shaders 1.15GHz | 1,280 Shaders 1.71GHz |
Shared Memory25.6GB/s · | 6GB GDDR5192GB/s placeholder |
·· 736 GFLOPS | ·· 4.37 TFLOPS |
Form Factor iGPU | Form Factor PCIe Card |
TDP Shared | TDP 120W |
Power Connectors - | Power Connectors 1x 6-Pin |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 736 GFLOPSFP32 | Peak OPS 4.37 TFLOPSFP32 |
FP32 736 GFLOPS | FP32 4.37 TFLOPS |
FP64 184 GFLOPS | FP64 136.6 GFLOPS |
Pixel Rate 4.6 GPixel/s | Pixel Rate 82 GPixel/s |
Texture Rate 46 GTexel/s | Texture Rate 136.6 GTexel/s |
Shaders 320 Shaders | Shaders 1,280 Shaders |
TMUs 40 TMUs | TMUs 80 TMUs |
ROPs 4 ROPs | ROPs 48 ROPs |
EUs 40 EUs | SMs 10 SMs |
Base Clock 200MHz | Base Clock 1.51GHz |
Boost Clock 1.15GHz | Boost Clock 1.71GHz |
L2 Cache - | L2 Cache 1.5MB shared |
Shared Memory · | 6GB GDDR5 placeholder |
Memory Bus 128-bit | Memory Bus 192-bit |
Memory Speed 1.6GT/s | Memory Speed 8GT/s |
Memory Bandwidth 25.6GB/s | Memory Bandwidth 192GB/s |
ECC No | ECC No |
EDRAM 128MBSize 128BitBus Width 100GB/sBandwidth | EDRAM - |
TDP Shared | TDP 120W |
Multi-Monitor 2 | Multi-Monitor 3 |
- | 3x DisplayPort 1.4 1x HDMI 2.0 1x DVI-D Dual-Link |
Encoder Model Quick Sync Video 3 | Encoder Model NVENC 4 |
Codec AVC (H.264) - | Codec AVC (H.264) HEVC (H.265) |
Decoder Model Quick Sync Video 3 | Decoder Model NVDEC 3 |
Codec MPEG-1 MPEG-2 MPEG-4 JPEG VC-1 - AVC (H.264) - | Codec MPEG-1 MPEG-2 MPEG-4 - VC-1 VP9 AVC (H.264) HEVC (H.265) |
Form Factor iGPU | Form Factor PCIe Card |
PCIe - | PCIe 2-Slots |
- | Height 112 mm (4.41")Width 250 mm (9.84")Depth 40 mm (1.57") |
Cooling Passive - | Cooling Blower 1x Fan |
Power Connectors - | Power Connectors 1x 6-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Haswell | Codename NV136 |
Chip Variant GT1 | Chip Variant GP106-300-A1 |
Market Segment Desktop | Market Segment Desktop |
Release Date May 27, 2013 | Release Date Jul 19, 2016 |
Foundry Intel | Foundry TSMC |
Fabrication Node 22nm | Fabrication Node 16FF |
Die Size 260mm² | Die Size 200mm² |
Transistor Count 1.7 Billion | Transistor Count 4.4 Billion |
Transistor Density 7 MTr/mm² | Transistor Density 22 MTr/mm² |

