GPUs

Intel UHD 32EU 1650MHz Gen 12 vs Apple 30-Core M2 Max Full Specs

256 Shaders
1.65GHz
3,840 Shaders
1.4GHz
Shared Memory89.6GB/s
·
Shared Memory409.6GB/sLPDDR5
··
844.8 GFLOPS
··
10.74 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

UHD 32EU 1650MHz Gen 12UHD 32EU 1650MHz Gen 121.69 TFLOPSFP16
x1
30-Core M2 Max30-Core M2 Max10.74 TFLOPSFP16
x6.35

Clock Speed
···
Clock Speed
··
Peak OPS
1.69 TFLOPSFP16
Peak OPS
10.74 TFLOPSFP16
FP32
844.8 GFLOPS
FP32
10.74 TFLOPS
FP64
211.2 GFLOPS
-
Pixel Rate
13.2 GPixel/s
Pixel Rate
167.8 GPixel/s
Texture Rate
26.4 GTexel/s
Texture Rate
335.5 GTexel/s

Shaders
256 Shaders
Shaders
3,840 Shaders
TMUs
16 TMUs
TMUs
240 TMUs
ROPs
8 ROPs
ROPs
120 ROPs
EUs
32 EUs
EUs
480 EUs

Base Clock
300MHz
Base Clock
-
Boost Clock
1.65GHz
Boost Clock
1.4GHz

L2 Cache
256KB shared
L2 Cache
8.2MB shared
L3 Cache
1MB shared
L3 Cache
-

Shared Memory
·
Shared MemoryLPDDR5
Memory Bus
128-bit
Memory Bus
512-bit
Memory Speed
5.6GT/s
Memory Speed
6.4GT/s
Memory Bandwidth
89.6GB/s
Memory Bandwidth
409.6GB/s
ECC
No
ECC
No

Multi-Monitor
4
Multi-Monitor
4

Encoder Model
Quick Sync Video 8
Encoder Model
2x Apple Media Engine 2

Decoder Model
Quick Sync Video 8
Decoder Model
Apple Media Engine 2

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
UHD 2020 branding
Branding
M2 Max branding
Codename
Xe LP
Codename
G14C
Chip Variant
GT1
Chip Variant
-
Market Segment
Laptop
Market Segment
Desktop
Release Date
Jan 1, 2023
Release Date
Jan 17, 2023

Foundry
Intel
Foundry
TSMC
Fabrication Node
Intel 7
Fabrication Node
N5P
Die Size
257mm²
Die Size
486mm²
Transistor Count
18.5 Billion
Transistor Count
67 Billion
Transistor Density
72 MTr/mm²
Transistor Density
138 MTr/mm²

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