Intel UHD 64EU 1200MHz Gen 12 vs NVIDIA GA10B 16SM 765MHz Full Specs

Summary

512 Shaders 1.2GHz	1,024 Shaders 765MHz
Shared Memory102.4GB/s LPDDR5X·DDR5·LPDDR4X·DDR4	Shared Memory102.4GB/sLPDDR5
Peak·FP32·FP16 1.23 TFLOPS	Peak·FP32·FP16 1.57 TFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Theoretical Performance

Clock Speed1200MHz UC·Base·Boost·OC	Clock Speed765MHz UC·Boost·OC
Peak OPS 2.46 TFLOPSFP16	Peak OPS 100.3 TOPSINT4 Tensor Sparse
-	Tensor FP16-16 12.53 TFLOPS FP16-16 Tensor Sparse 25.07 TFLOPS Tensor FP16-32 12.53 TFLOPS FP16-32 Tensor Sparse 25.07 TFLOPS
-	Tensor BF16 12.53 TFLOPS BF16 Tensor Sparse 25.07 TFLOPS
Tensor TF32 -	Tensor TF32 6.27 TFLOPS
FP32 1.23 TFLOPS	FP32 1.57 TFLOPS
FP64 307.2 GFLOPS	-
Tensor INT4 -	Tensor INT4 50.14 TOPS
-	Tensor INT8 25.07 TOPS
Pixel Rate 19.2 GPixel/s	Pixel Rate 12.2 GPixel/s
Texture Rate 38.4 GTexel/s	Texture Rate 6.1 GTexel/s

Core Config

Shaders 512 Shaders	Shaders 1,024 Shaders
TMUs 32 TMUs	TMUs 8 TMUs
ROPs 16 ROPs	ROPs 16 ROPs
Tensor Cores -	Tensor Cores 32 T-Cores
EUs 64 EUs	SMs 8 SMs

Clocks

Base Clock 300MHz	Base Clock -
Boost Clock 1.2GHz	Boost Clock 765MHz

Cache

L2 Cache 512KB shared	L2 Cache 2MB shared
L3 Cache 2MB shared	L3 Cache -

Memory

Shared Memory LPDDR5X·DDR5·LPDDR4X·DDR4	Shared MemoryLPDDR5
Memory Bus 128-bit	Memory Bus 128-bit
Memory Speed 6.4GT/s	Memory Speed 6.4GT/s
Memory Bandwidth 102.4GB/s	Memory Bandwidth 102.4GB/s
ECC No	ECC No

Video Output

Multi-Monitor 4

Multi-Monitor -

Encoder

Encoder Model Quick Sync Video 8	Encoder Model NVENC 7
Codec JPEG VP9 AVC (H.264) HEVC (H.265) AV1	Codec - - AVC (H.264) HEVC (H.265) -

Decoder

Decoder Model Quick Sync Video 8	Decoder Model NVDEC 5
Codec MPEG-1 MPEG-2 MPEG-4 JPEG VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) AV1	Codec MPEG-1 MPEG-2 MPEG-4 - VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) AV1

Card

Form Factor iGPU

Form Factor iGPU

Chip

Manufacturer Intel	Manufacturer NVIDIA
Chip Designer Intel	Chip Designer NVIDIA
Architecture Gen 12	Architecture Ampere
Family Gen 12	Family Jetson
Branding	Branding
Codename Xe LP	Codename Hercules
Chip Variant GT1	Chip Variant -
Market Segment Laptop	Market Segment Embedded
Release Date Jan 1, 2023	Release Date Jan 1, 2023

Fabrication

Foundry Intel	Foundry Samsung
Fabrication Node Intel 7	Fabrication Node 8N
Die Size 161mm²	Die Size -
Transistor Count 11.9 Billion	Transistor Count 17 Billion
Transistor Density 74 MTr/mm²	Transistor Density -

Images