GPUs

Intel UHD 730 1300MHz vs NVIDIA GeForce RTX 3050 Full Specs

192 Shaders
1.3GHz
2,560 Shaders
1.78GHz
Shared Memory51.2GB/sDDR4
8GB GDDR6224GB/s
··
499.2 GFLOPS
··
9.1 TFLOPS
Form Factor
iGPU
Form Factor
PCIe Card
TDP
Shared
TDP
115W
Power Connectors
-
Power Connectors
1x 12-Pin

UHD 730 1300MHzUHD 730 1300MHz998.4 GFLOPSFP16
x1
GeForce RTX 3050GeForce RTX 3050291.1 TOPSINT4 Tensor Sparse
x291.61

Clock Speed
··
Clock Speed
···
Peak OPS
998.4 GFLOPSFP16
Peak OPS
291.1 TOPSINT4 Tensor Sparse
-
Tensor FP16-16
36.39 TFLOPS
FP16-16 Tensor Sparse
72.79 TFLOPS
Tensor FP16-32
18.2 TFLOPS
FP16-32 Tensor Sparse
36.39 TFLOPS
-
BF16
9.1 TFLOPS
Tensor BF16
18.2 TFLOPS
BF16 Tensor Sparse
36.39 TFLOPS
Tensor TF32
-
Tensor TF32
9.1 TFLOPS
FP32
499.2 GFLOPS
FP32
9.1 TFLOPS
FP64
124.8 GFLOPS
FP64
142.2 GFLOPS
Tensor INT4
-
Tensor INT4
145.6 TOPS
-
Tensor INT8
72.79 TOPS
Ray
-
Ray
13.72 TOPS
Pixel Rate
10.4 GPixel/s
Pixel Rate
56.9 GPixel/s
Texture Rate
15.6 GTexel/s
Texture Rate
142.2 GTexel/s

Shaders
192 Shaders
Shaders
2,560 Shaders
TMUs
12 TMUs
TMUs
80 TMUs
ROPs
8 ROPs
ROPs
32 ROPs
Tensor Cores
-
Tensor Cores
80 T-Cores
RT Cores
-
RT Cores
20 RT-Cores
EUs
24 EUs
SMs
20 SMs

Base Clock
-
Base Clock
1.55GHz
Boost Clock
1.3GHz
Boost Clock
1.78GHz

L2 Cache
-
L2 Cache
2MB shared

Shared MemoryDDR4
8GB GDDR6
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
3.2GT/s
Memory Speed
14GT/s
Memory Bandwidth
51.2GB/s
Memory Bandwidth
224GB/s
ECC
No
ECC
No

TDP
Shared
TDP
115W

Multi-Monitor
3
Multi-Monitor
3
HDCP
-
HDCP
HDCP 2.3

-
3x DisplayPort 1.4
-
1x HDMI 2.1

Encoder Model
Quick Sync Video 7
Encoder Model
NVENC 7

Decoder Model
Quick Sync Video 7
Decoder Model
NVDEC 5

Form Factor
iGPU
Form Factor
PCIe Card
PCIe
-
PCIe
1.9-Slots
-
Height
112 mm (4.41")
Width
242 mm (9.53")
Depth
38 mm (1.5")
Cooling
Passive
-
Cooling
Open-Air
2x Fans
Power Connectors
-
Power Connectors
1x 12-Pin

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
UHD 2020 branding
Branding
GeForce RTX 2018 branding
Codename
Xe LP
Codename
NV177
Chip Variant
GT1
Chip Variant
GA107-140-A1
Market Segment
Desktop
Market Segment
Desktop
Release Date
Mar 16, 2021
Release Date
Dec 16, 2022

Foundry
Intel
Foundry
Samsung
Fabrication Node
14nm++++
Fabrication Node
8N
Die Size
276mm²
Die Size
200mm²
Transistor Count
6.9 Billion
Transistor Count
8.7 Billion
Transistor Density
25 MTr/mm²
Transistor Density
43.5 MTr/mm²

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