GPUs

MSI GeForce RTX 3050 LP 6G OC vs NVIDIA GeForce FX 5700 Ultra Full Specs

2,304 Shaders
1.49GHz
4 Shaders
475MHz
6GB GDDR6168GB/s
262MB GDDR214.4GB/s
··
6.88 TFLOPS
··
-
Form Factor
PCIe Card
Form Factor
AGP 8x Card
TDP
70W
TDP
46W
Power Connectors
-
Power Connectors
1x Molex

GeForce RTX 3050 LP 6G OCGeForce RTX 3050 LP 6G OC220 TOPSINT4 Tensor Sparse
x1
GeForce FX 5700 UltraGeForce FX 5700 Ultra-
-

Clock Speed
···
Clock Speed
··
Peak OPS
220 TOPSINT4 Tensor Sparse
Peak OPS
-
Tensor FP16-16
27.5 TFLOPS
FP16-16 Tensor Sparse
55 TFLOPS
Tensor FP16-32
13.75 TFLOPS
FP16-32 Tensor Sparse
27.5 TFLOPS
-
BF16
6.88 TFLOPS
Tensor BF16
13.75 TFLOPS
BF16 Tensor Sparse
27.5 TFLOPS
-
Tensor TF32
6.88 TFLOPS
Tensor TF32
-
FP32
6.88 TFLOPS
-
FP64
107.4 GFLOPS
-
Tensor INT4
110 TOPS
Tensor INT4
-
Tensor INT8
55 TOPS
-
Ray
10.37 TOPS
Ray
-
Pixel Rate
47.7 GPixel/s
Pixel Rate
1.9 GPixel/s
Texture Rate
107.4 GTexel/s
Texture Rate
1.9 GTexel/s

Shaders
2,304 Shaders
Shaders
4 Shaders
TMUs
72 TMUs
TMUs
4 TMUs
ROPs
32 ROPs
ROPs
4 ROPs
Tensor Cores
72 T-Cores
Tensor Cores
-
RT Cores
18 RT-Cores
RT Cores
-
SMs
18 SMs
Units
-

Base Clock
1.04GHz
Base Clock
-
Boost Clock
1.49GHz
Boost Clock
475MHz

L2 Cache
2MB shared
L2 Cache
-

6GB GDDR6
262MB GDDR2
Memory Bus
96-bit
Memory Bus
128-bit
Memory Speed
14GT/s
Memory Speed
900MT/s
Memory Bandwidth
168GB/s
Memory Bandwidth
14.4GB/s

TDP
70W
TDP
46W

Multi-Monitor
3
Multi-Monitor
2
HDCP
HDCP 2.3
HDCP
-

1x DisplayPort 1.4
-
2x HDMI 2.1
-
-
1x DVI-I Single-Link
-
1x VGA
-
1x S-Video

Encoder Model
NVENC 7
-

Decoder Model
NVDEC 5
Decoder Model
VPE 3.0

Form Factor
PCIe Card
Form Factor
AGP 8x Card
PCIe
2-Slots
PCIe
1-Slots
Height
69 mm (2.72")
Width
174 mm (6.85")
Depth
40 mm (1.57")
Height
111 mm (4.37")
Width
229 mm (9.02")
Depth
20 mm (0.79")
Cooling
Open-Air
2x Fans
Cooling
Blower
1x Fan
Power Connectors
-
Power Connectors
1x Molex

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
GeForce RTX 2018 branding
Branding
GeForce FX branding
Codename
NV177
Codename
NV36
Chip Variant
GA107-140-A1
Chip Variant
-
Market Segment
Desktop
Market Segment
Desktop
Release Date
Feb 2, 2024
Release Date
Oct 23, 2003

Foundry
Samsung
Foundry
TSMC
Fabrication Node
8N
Fabrication Node
130nm
Die Size
200mm²
Die Size
133mm²
Transistor Count
8.7 Billion
Transistor Count
82 Million
Transistor Density
43.5 MTr/mm²
Transistor Density
0.62 MTr/mm²

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