GPUs

MSI GeForce RTX 3050 LP 6G OC vs NVIDIA GeForce PCX 5750 Full Specs

2,304 Shaders
1.49GHz
4 Shaders
425MHz
6GB GDDR6168GB/s
131MB DDR8GB/s
··
6.88 TFLOPS
··
-
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
70W
TDP
50W

GeForce RTX 3050 LP 6G OCGeForce RTX 3050 LP 6G OC220 TOPSINT4 Tensor Sparse
x1
GeForce PCX 5750GeForce PCX 5750-
-

Clock Speed
···
Clock Speed
··
Peak OPS
220 TOPSINT4 Tensor Sparse
Peak OPS
-
Tensor FP16-16
27.5 TFLOPS
FP16-16 Tensor Sparse
55 TFLOPS
Tensor FP16-32
13.75 TFLOPS
FP16-32 Tensor Sparse
27.5 TFLOPS
-
BF16
6.88 TFLOPS
Tensor BF16
13.75 TFLOPS
BF16 Tensor Sparse
27.5 TFLOPS
-
Tensor TF32
6.88 TFLOPS
Tensor TF32
-
FP32
6.88 TFLOPS
-
FP64
107.4 GFLOPS
-
Tensor INT4
110 TOPS
Tensor INT4
-
Tensor INT8
55 TOPS
-
Ray
10.37 TOPS
Ray
-
Pixel Rate
47.7 GPixel/s
Pixel Rate
1.7 GPixel/s
Texture Rate
107.4 GTexel/s
Texture Rate
1.7 GTexel/s

Shaders
2,304 Shaders
Shaders
4 Shaders
TMUs
72 TMUs
TMUs
4 TMUs
ROPs
32 ROPs
ROPs
4 ROPs
Tensor Cores
72 T-Cores
Tensor Cores
-
RT Cores
18 RT-Cores
RT Cores
-
SMs
18 SMs
Units
-

Base Clock
1.04GHz
Base Clock
-
Boost Clock
1.49GHz
Boost Clock
425MHz

L2 Cache
2MB shared
L2 Cache
-

6GB GDDR6
131MB DDR
Memory Bus
96-bit
Memory Bus
128-bit
Memory Speed
14GT/s
Memory Speed
500MT/s
Memory Bandwidth
168GB/s
Memory Bandwidth
8GB/s

TDP
70W
TDP
50W

Multi-Monitor
3
Multi-Monitor
2
HDCP
HDCP 2.3
HDCP
-

1x DisplayPort 1.4
-
2x HDMI 2.1
-
-
1x DVI-I Single-Link
-
1x VGA
-
1x S-Video

Encoder Model
NVENC 7
-

Decoder Model
NVDEC 5
Decoder Model
VPE 3.0

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
2-Slots
PCIe
1-Slots
Height
69 mm (2.72")
Width
174 mm (6.85")
Depth
40 mm (1.57")
Height
111 mm (4.37")
Width
168 mm (6.61")
Depth
20 mm (0.79")
Cooling
Open-Air
2x Fans
Cooling
Open-Air
1x Fan

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
GeForce RTX 2018 branding
Branding
GeForce FX branding
Codename
NV177
Codename
NV36
Chip Variant
GA107-140-A1
Chip Variant
-
Market Segment
Desktop
Market Segment
Desktop
Release Date
Feb 2, 2024
Release Date
Mar 17, 2004

Foundry
Samsung
Foundry
TSMC
Fabrication Node
8N
Fabrication Node
130nm
Die Size
200mm²
Die Size
133mm²
Transistor Count
8.7 Billion
Transistor Count
82 Million
Transistor Density
43.5 MTr/mm²
Transistor Density
0.62 MTr/mm²

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