GPUs

MSI GeForce RTX 3050 LP 6G OC vs NVIDIA Quadro P2000 Full Specs

2,304 Shaders
1.49GHz
1,024 Shaders
1.48GHz
6GB GDDR6168GB/s
5GB GDDR5160.2GB/s
··
6.88 TFLOPS
··
3.03 TFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
70W
TDP
75W

GeForce RTX 3050 LP 6G OCGeForce RTX 3050 LP 6G OC220 TOPSINT4 Tensor Sparse
x72.58
Quadro P2000Quadro P20003.03 TFLOPSFP32
x1

Clock Speed
···
Clock Speed
···
Peak OPS
220 TOPSINT4 Tensor Sparse
Peak OPS
3.03 TFLOPSFP32
Tensor FP16-16
27.5 TFLOPS
FP16-16 Tensor Sparse
55 TFLOPS
Tensor FP16-32
13.75 TFLOPS
FP16-32 Tensor Sparse
27.5 TFLOPS
-
BF16
6.88 TFLOPS
Tensor BF16
13.75 TFLOPS
BF16 Tensor Sparse
27.5 TFLOPS
-
Tensor TF32
6.88 TFLOPS
Tensor TF32
-
FP32
6.88 TFLOPS
FP32
3.03 TFLOPS
FP64
107.4 GFLOPS
FP64
94.72 GFLOPS
Tensor INT4
110 TOPS
Tensor INT4
-
Tensor INT8
55 TOPS
-
Ray
10.37 TOPS
Ray
-
Pixel Rate
47.7 GPixel/s
Pixel Rate
59.2 GPixel/s
Texture Rate
107.4 GTexel/s
Texture Rate
94.7 GTexel/s

Shaders
2,304 Shaders
Shaders
1,024 Shaders
TMUs
72 TMUs
TMUs
64 TMUs
ROPs
32 ROPs
ROPs
40 ROPs
Tensor Cores
72 T-Cores
Tensor Cores
-
RT Cores
18 RT-Cores
RT Cores
-
SMs
18 SMs
SMs
8 SMs

Base Clock
1.04GHz
Base Clock
1.08GHz
Boost Clock
1.49GHz
Boost Clock
1.48GHz

L2 Cache
2MB shared
L2 Cache
1.3MB shared

6GB GDDR6
5GB GDDR5
Memory Bus
96-bit
Memory Bus
160-bit
Memory Speed
14GT/s
Memory Speed
8GT/s
Memory Bandwidth
168GB/s
Memory Bandwidth
160.2GB/s
ECC
No
ECC
No

TDP
70W
TDP
75W

Multi-Monitor
3
Multi-Monitor
3
HDCP
HDCP 2.3
HDCP
-

1x DisplayPort 1.4
4x DisplayPort 1.4
2x HDMI 2.1
-

Encoder Model
NVENC 7
Encoder Model
NVENC 4

Decoder Model
NVDEC 5
Decoder Model
NVDEC 3

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
2-Slots
PCIe
1-Slots
Height
69 mm (2.72")
Width
174 mm (6.85")
Depth
40 mm (1.57")
Height
111 mm (4.37")
Width
196 mm (7.72")
Depth
20 mm (0.79")
Cooling
Open-Air
2x Fans
Cooling
Blower
1x Fan

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
GeForce RTX 2018 branding
Branding
Quadro 2012 branding
Codename
NV177
Codename
NV136
Chip Variant
GA107-140-A1
Chip Variant
GP106-300-A1
Market Segment
Desktop
Market Segment
Workstation
Release Date
Feb 2, 2024
Release Date
Feb 6, 2017

Foundry
Samsung
Foundry
TSMC
Fabrication Node
8N
Fabrication Node
16FF
Die Size
200mm²
Die Size
200mm²
Transistor Count
8.7 Billion
Transistor Count
4.4 Billion
Transistor Density
43.5 MTr/mm²
Transistor Density
22 MTr/mm²

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