NVIDIA A10 vs NVIDIA A30 Full Specs
9,216 Shaders 1.7GHz | 3,584 Shaders 1.44GHz |
24GB GDDR6300.3GB/s | 24GB HBM2933.1GB/s |
·· 31.24 TFLOPS | ·· 10.32 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 150W | TDP 165W |
Power Connectors 1x 8-Pin | Power Connectors - |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 999.8 TOPSINT4 Tensor Sparse | Peak OPS 1.32 POPSINT4 Tensor Sparse |
Tensor FP16-16 125 TFLOPSFP16-16 Tensor Sparse 249.9 TFLOPSTensor FP16-32 62.48 TFLOPSFP16-32 Tensor Sparse 125 TFLOPS | Tensor FP16-16 165.2 TFLOPSFP16-16 Tensor Sparse 330.3 TFLOPSTensor FP16-32 165.2 TFLOPSFP16-32 Tensor Sparse 330.3 TFLOPS |
BF16 31.24 TFLOPSTensor BF16 62.48 TFLOPSBF16 Tensor Sparse 125 TFLOPS | BF16 20.64 TFLOPSTensor BF16 165.2 TFLOPSBF16 Tensor Sparse 330.3 TFLOPS |
Tensor TF32 31.24 TFLOPS | Tensor TF32 82.58 TFLOPS |
FP32 31.24 TFLOPS | FP32 10.32 TFLOPS |
FP64 488.2 GFLOPSTensor FP64 - | FP64 5.16 TFLOPSTensor FP64 10.32 TFLOPS |
Tensor INT4 499.9 TOPS | Tensor INT4 660.6 TOPS |
Tensor INT8 249.9 TOPS | Tensor INT8 330.3 TOPS |
Ray 47.12 TOPS | Ray - |
Pixel Rate 162.7 GPixel/s | Pixel Rate 138.2 GPixel/s |
Texture Rate 488.2 GTexel/s | Texture Rate 322.6 GTexel/s |
Shaders 9,216 Shaders | Shaders 3,584 Shaders |
TMUs 288 TMUs | TMUs 224 TMUs |
ROPs 96 ROPs | ROPs 96 ROPs |
Tensor Cores 288 T-Cores | Tensor Cores 224 T-Cores |
RT Cores 72 RT-Cores | RT Cores - |
SMs 72 SMs | SMs 56 SMs |
Base Clock 885MHz | Base Clock 930MHz |
Boost Clock 1.7GHz | Boost Clock 1.44GHz |
L2 Cache 6.1MB shared | L2 Cache 24.6MB shared |
24GB GDDR6 | 24GB HBM2 |
Memory Bus 384-bit | Memory Bus 3072-bit |
Memory Speed 6.3GT/s | Memory Speed 2.4GT/s |
Memory Bandwidth 300.3GB/s | Memory Bandwidth 933.1GB/s |
TDP 150W | TDP 165W |
Encoder Model NVENC 7 | - |
Decoder Model NVDEC 5 | Decoder Model 5x NVDEC 4 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 1-Slots | PCIe 2-Slots |
Height 112 mm (4.41")Width 267 mm (10.51")Depth 20 mm (0.79") | Height 111 mm (4.37")Width 267 mm (10.51")Depth 40 mm (1.57") |
Cooling Passive | Cooling Passive |
Power Connectors 1x 8-Pin | Power Connectors - |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename NV172 | Codename NV170 |
Chip Variant GA102-200-KD-A1 | Chip Variant - |
Market Segment Server | Market Segment Server |
Release Date Apr 12, 2021 | Release Date Apr 12, 2021 |
Foundry Samsung | Foundry TSMC |
Fabrication Node 8N | Fabrication Node 7N |
Die Size 628mm² | Die Size 826mm² |
Transistor Count 28.3 Billion | Transistor Count 54.2 Billion |
Transistor Density 45.04 MTr/mm² | Transistor Density 65.62 MTr/mm² |
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