NVIDIA A10 vs NVIDIA H100 SXM Full Specs
9,216 Shaders 1.7GHz | 16,896 Shaders 1.98GHz |
24GB GDDR6300.3GB/s | 96GB HBM33.35TB/s |
·· 31.24 TFLOPS | ·· 66.91 TFLOPS |
Form Factor PCIe Card | Form Factor SXM5 |
TDP 150W | TDP 700W |
Power Connectors 1x 8-Pin | Power Connectors - |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 999.8 TOPSINT4 Tensor Sparse | Peak OPS 3.96 POPSINT8 Tensor Sparse |
- | Tensor FP8-16 1.98 PFLOPSFP8-16 Tensor Sparse 3.96 PFLOPSTensor FP8-32 1.98 PFLOPSFP8-32 Tensor Sparse 3.96 PFLOPS |
Tensor FP16-16 125 TFLOPSFP16-16 Tensor Sparse 249.9 TFLOPSTensor FP16-32 62.48 TFLOPSFP16-32 Tensor Sparse 125 TFLOPS | Tensor FP16-16 989.4 TFLOPSFP16-16 Tensor Sparse 1.98 PFLOPSTensor FP16-32 989.4 TFLOPSFP16-32 Tensor Sparse 1.98 PFLOPS |
BF16 31.24 TFLOPSTensor BF16 62.48 TFLOPSBF16 Tensor Sparse 125 TFLOPS | BF16 133.8 TFLOPSTensor BF16 989.4 TFLOPSBF16 Tensor Sparse 1.98 PFLOPS |
Tensor TF32 31.24 TFLOPS | Tensor TF32 494.7 TFLOPS |
FP32 31.24 TFLOPS | FP32 66.91 TFLOPS |
FP64 488.2 GFLOPSTensor FP64 - | FP64 33.45 TFLOPSTensor FP64 61.84 TFLOPS |
Tensor INT4 499.9 TOPS | Tensor INT4 - |
Tensor INT8 249.9 TOPS | Tensor INT8 1.98 POPS |
Ray 47.12 TOPS | Ray - |
Pixel Rate 162.7 GPixel/s | Pixel Rate 47.5 GPixel/s |
Texture Rate 488.2 GTexel/s | Texture Rate 1.04 TTexel/s |
Shaders 9,216 Shaders | Shaders 16,896 Shaders |
TMUs 288 TMUs | TMUs 528 TMUs |
ROPs 96 ROPs | ROPs 24 ROPs |
Tensor Cores 288 T-Cores | Tensor Cores 528 T-Cores |
RT Cores 72 RT-Cores | RT Cores - |
SMs 72 SMs | SMs 132 SMs |
Base Clock 885MHz | Base Clock 1.06GHz |
Boost Clock 1.7GHz | Boost Clock 1.98GHz |
Tensor Clock - | Tensor Clock 1.83GHz |
L2 Cache 6.1MB shared | L2 Cache 51.2MB shared |
24GB GDDR6 | 96GB HBM3 |
Memory Bus 384-bit | Memory Bus 5120-bit |
Memory Speed 6.3GT/s | Memory Speed 5.2GT/s |
Memory Bandwidth 300.3GB/s | Memory Bandwidth 3.35TB/s |
TDP 150W | TDP 700W |
Encoder Model NVENC 7 | - |
Decoder Model NVDEC 5 | Decoder Model 7x NVDEC 5 |
Form Factor PCIe Card | Form Factor SXM5 |
PCIe 1-Slots | PCIe - |
Height 112 mm (4.41")Width 267 mm (10.51")Depth 20 mm (0.79") | - |
Cooling Passive | Cooling Passive |
Power Connectors 1x 8-Pin | Power Connectors - |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename NV172 | Codename NV180 |
Chip Variant GA102-200-KD-A1 | Chip Variant - |
Market Segment Server | Market Segment Server |
Release Date Apr 12, 2021 | Release Date Mar 22, 2022 |
Foundry Samsung | Foundry TSMC |
Fabrication Node 8N | Fabrication Node 4N |
Die Size 628mm² | Die Size 814mm² |
Transistor Count 28.3 Billion | Transistor Count 80 Billion |
Transistor Density 45.04 MTr/mm² | Transistor Density 98.28 MTr/mm² |
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