NVIDIA A100 40GB vs NVIDIA A40 Full Specs
6,912 Shaders 1.41GHz | 10,752 Shaders 1.74GHz |
40GB HBM2e1.55TB/s | 48GB GDDR6347.9GB/s |
·· 19.49 TFLOPS | ·· 37.42 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 250W | TDP 300W |
Power Connectors 1x 8-Pin EPS | Power Connectors 1x 8-Pin EPS |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 2.5 POPSINT4 Tensor Sparse | Peak OPS 1.2 POPSINT4 Tensor Sparse |
Tensor FP16-16 311.9 TFLOPSFP16-16 Tensor Sparse 623.7 TFLOPSTensor FP16-32 311.9 TFLOPSFP16-32 Tensor Sparse 623.7 TFLOPS | Tensor FP16-16 149.7 TFLOPSFP16-16 Tensor Sparse 299.3 TFLOPSTensor FP16-32 74.83 TFLOPSFP16-32 Tensor Sparse 149.7 TFLOPS |
BF16 38.98 TFLOPSTensor BF16 311.9 TFLOPSBF16 Tensor Sparse 623.7 TFLOPS | BF16 37.42 TFLOPSTensor BF16 74.83 TFLOPSBF16 Tensor Sparse 149.7 TFLOPS |
Tensor TF32 155.9 TFLOPS | Tensor TF32 37.42 TFLOPS |
FP32 19.49 TFLOPS | FP32 37.42 TFLOPS |
FP64 9.75 TFLOPSTensor FP64 19.49 TFLOPS | FP64 584.6 GFLOPSTensor FP64 - |
Tensor INT4 1.25 POPS | Tensor INT4 598.7 TOPS |
Tensor INT8 623.7 TOPS | Tensor INT8 299.3 TOPS |
Ray - | Ray 56.43 TOPS |
Pixel Rate 225.6 GPixel/s | Pixel Rate 194.9 GPixel/s |
Texture Rate 609.1 GTexel/s | Texture Rate 584.6 GTexel/s |
Shaders 6,912 Shaders | Shaders 10,752 Shaders |
TMUs 432 TMUs | TMUs 336 TMUs |
ROPs 160 ROPs | ROPs 112 ROPs |
Tensor Cores 432 T-Cores | Tensor Cores 336 T-Cores |
RT Cores - | RT Cores 84 RT-Cores |
SMs 108 SMs | SMs 84 SMs |
Base Clock 765MHz | Base Clock 1.3GHz |
Boost Clock 1.41GHz | Boost Clock 1.74GHz |
L2 Cache 41MB shared | L2 Cache 6.1MB shared |
40GB HBM2e | 48GB GDDR6 |
Memory Bus 5120-bit | Memory Bus 384-bit |
Memory Speed 2.4GT/s | Memory Speed 7.2GT/s |
Memory Bandwidth 1.55TB/s | Memory Bandwidth 347.9GB/s |
TDP 250W | TDP 300W |
Multi-Monitor - | Multi-Monitor 3 |
HDCP - | HDCP HDCP 2.3 |
- | 3x DisplayPort 1.3 |
- | Encoder Model NVENC 7 |
Decoder Model 5x NVDEC 4 | Decoder Model NVDEC 5 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 2-Slots |
Height 111 mm (4.37")Width 267 mm (10.51")Depth 40 mm (1.57") | Height 112 mm (4.41")Width 267 mm (10.51")Depth 40 mm (1.57") |
Cooling Passive | Cooling Passive |
Power Connectors 1x 8-Pin EPS | Power Connectors 1x 8-Pin EPS |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename NV170 | Codename NV172 |
Chip Variant - | Chip Variant GA102-200-KD-A1 |
Market Segment Server | Market Segment Server |
Release Date Jun 28, 2021 | Release Date Oct 5, 2020 |
Foundry TSMC | Foundry Samsung |
Fabrication Node 7N | Fabrication Node 8N |
Die Size 826mm² | Die Size 628mm² |
Transistor Count 54.2 Billion | Transistor Count 28.3 Billion |
Transistor Density 65.62 MTr/mm² | Transistor Density 45.04 MTr/mm² |
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