NVIDIA A2 vs NVIDIA A800 40GB Full Specs
1,280 Shaders 1.77GHz | 6,912 Shaders 1.41GHz |
16GB GDDR6100.1GB/s | 40GB HBM2e1.55TB/s |
·· 4.53 TFLOPS | ·· 19.49 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 60W | TDP 250W |
Power Connectors - | Power Connectors 1x 8-Pin EPS |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 145 TOPSINT4 Tensor Sparse | Peak OPS 2.5 POPSINT4 Tensor Sparse |
Tensor FP16-16 18.12 TFLOPSFP16-16 Tensor Sparse 36.25 TFLOPSTensor FP16-32 9.06 TFLOPSFP16-32 Tensor Sparse 18.12 TFLOPS | Tensor FP16-16 311.9 TFLOPSFP16-16 Tensor Sparse 623.7 TFLOPSTensor FP16-32 311.9 TFLOPSFP16-32 Tensor Sparse 623.7 TFLOPS |
BF16 4.53 TFLOPSTensor BF16 9.06 TFLOPSBF16 Tensor Sparse 18.12 TFLOPS | BF16 38.98 TFLOPSTensor BF16 311.9 TFLOPSBF16 Tensor Sparse 623.7 TFLOPS |
Tensor TF32 4.53 TFLOPS | Tensor TF32 155.9 TFLOPS |
FP32 4.53 TFLOPS | FP32 19.49 TFLOPS |
FP64 70.8 GFLOPSTensor FP64 - | FP64 9.75 TFLOPSTensor FP64 19.49 TFLOPS |
Tensor INT4 72.5 TOPS | Tensor INT4 1.25 POPS |
Tensor INT8 36.25 TOPS | Tensor INT8 623.7 TOPS |
Ray 6.83 TOPS | Ray - |
Pixel Rate 56.6 GPixel/s | Pixel Rate 225.6 GPixel/s |
Texture Rate 70.8 GTexel/s | Texture Rate 609.1 GTexel/s |
Shaders 1,280 Shaders | Shaders 6,912 Shaders |
TMUs 40 TMUs | TMUs 432 TMUs |
ROPs 32 ROPs | ROPs 160 ROPs |
Tensor Cores 40 T-Cores | Tensor Cores 432 T-Cores |
RT Cores 10 RT-Cores | RT Cores - |
SMs 10 SMs | SMs 108 SMs |
Base Clock 1.44GHz | Base Clock 765MHz |
Boost Clock 1.77GHz | Boost Clock 1.41GHz |
L2 Cache 2MB shared | L2 Cache 41MB shared |
16GB GDDR6 | 40GB HBM2e |
Memory Bus 128-bit | Memory Bus 5120-bit |
Memory Speed 6.3GT/s | Memory Speed 2.4GT/s |
Memory Bandwidth 100.1GB/s | Memory Bandwidth 1.55TB/s |
TDP 60W | TDP 250W |
Encoder Model NVENC 7 | - |
Decoder Model NVDEC 5 | Decoder Model 5x NVDEC 4 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 1-Slots | PCIe 2-Slots |
Height 69 mm (2.72")Width 168 mm (6.61")Depth 20 mm (0.79") | Height 111 mm (4.37")Width 267 mm (10.51")Depth 40 mm (1.57") |
Cooling Passive | Cooling Passive |
Power Connectors - | Power Connectors 1x 8-Pin EPS |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename NV177 | Codename NV170 |
Chip Variant GA107-140-A1 | Chip Variant - |
Market Segment Server | Market Segment Server |
Release Date Nov 10, 2021 | Release Date Jun 28, 2021 |
Foundry Samsung | Foundry TSMC |
Fabrication Node 8N | Fabrication Node 7N |
Die Size 200mm² | Die Size 826mm² |
Transistor Count 8.7 Billion | Transistor Count 54.2 Billion |
Transistor Density 43.5 MTr/mm² | Transistor Density 65.62 MTr/mm² |
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