GPUs

NVIDIA A2 vs NVIDIA H100 Full Specs

1,280 Shaders
1.77GHz
14,592 Shaders
1.75GHz
16GB GDDR6100.1GB/s
80GB HBM2e2.04TB/s
··
4.53 TFLOPS
··
51.22 TFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
60W
TDP
350W
Power Connectors
-
Power Connectors
1x 16-Pin 12VHPWR

A2A2145 TOPSINT4 Tensor Sparse
x1
H100H1003.03 POPSINT8 Tensor Sparse
x20.87

Clock Speed
···
Clock Speed
···
Peak OPS
145 TOPSINT4 Tensor Sparse
Peak OPS
3.03 POPSINT8 Tensor Sparse
-
Tensor FP8-16
1.51 PFLOPS
FP8-16 Tensor Sparse
3.03 PFLOPS
Tensor FP8-32
1.51 PFLOPS
FP8-32 Tensor Sparse
3.03 PFLOPS
Tensor FP16-16
18.12 TFLOPS
FP16-16 Tensor Sparse
36.25 TFLOPS
Tensor FP16-32
9.06 TFLOPS
FP16-32 Tensor Sparse
18.12 TFLOPS
Tensor FP16-16
756.4 TFLOPS
FP16-16 Tensor Sparse
1.51 PFLOPS
Tensor FP16-32
756.4 TFLOPS
FP16-32 Tensor Sparse
1.51 PFLOPS
BF16
4.53 TFLOPS
Tensor BF16
9.06 TFLOPS
BF16 Tensor Sparse
18.12 TFLOPS
BF16
102.4 TFLOPS
Tensor BF16
756.4 TFLOPS
BF16 Tensor Sparse
1.51 PFLOPS
Tensor TF32
4.53 TFLOPS
Tensor TF32
378.2 TFLOPS
FP32
4.53 TFLOPS
FP32
51.22 TFLOPS
FP64
70.8 GFLOPS
Tensor FP64
-
FP64
25.61 TFLOPS
Tensor FP64
47.28 TFLOPS
Tensor INT4
72.5 TOPS
Tensor INT4
-
Tensor INT8
36.25 TOPS
Tensor INT8
1.51 POPS
Ray
6.83 TOPS
Ray
-
Pixel Rate
56.6 GPixel/s
Pixel Rate
42.1 GPixel/s
Texture Rate
70.8 GTexel/s
Texture Rate
800.3 GTexel/s

Shaders
1,280 Shaders
Shaders
14,592 Shaders
TMUs
40 TMUs
TMUs
456 TMUs
ROPs
32 ROPs
ROPs
24 ROPs
Tensor Cores
40 T-Cores
Tensor Cores
456 T-Cores
RT Cores
10 RT-Cores
RT Cores
-
SMs
10 SMs
SMs
114 SMs

Base Clock
1.44GHz
Base Clock
1.06GHz
Boost Clock
1.77GHz
Boost Clock
1.75GHz
Tensor Clock
-
Tensor Clock
1.62GHz

L2 Cache
2MB shared
L2 Cache
51.2MB shared

16GB GDDR6
80GB HBM2e
Memory Bus
128-bit
Memory Bus
5120-bit
Memory Speed
6.3GT/s
Memory Speed
3.2GT/s
Memory Bandwidth
100.1GB/s
Memory Bandwidth
2.04TB/s

TDP
60W
TDP
350W

Encoder Model
NVENC 7
-

Decoder Model
NVDEC 5
Decoder Model
7x NVDEC 5

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
1-Slots
PCIe
2-Slots
Height
69 mm (2.72")
Width
168 mm (6.61")
Depth
20 mm (0.79")
Height
111 mm (4.37")
Width
268 mm (10.55")
Depth
40 mm (1.57")
Cooling
Passive
Cooling
Passive
Power Connectors
-
Power Connectors
1x 16-Pin 12VHPWR

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
A2 branding
Branding
H100 branding
Codename
NV177
Codename
NV180
Chip Variant
GA107-140-A1
Chip Variant
-
Market Segment
Server
Market Segment
Server
Release Date
Nov 10, 2021
Release Date
Mar 22, 2022

Foundry
Samsung
Foundry
TSMC
Fabrication Node
8N
Fabrication Node
4N
Die Size
200mm²
Die Size
814mm²
Transistor Count
8.7 Billion
Transistor Count
80 Billion
Transistor Density
43.5 MTr/mm²
Transistor Density
98.28 MTr/mm²

No images available
No images available