GPUs

NVIDIA A30 vs NVIDIA A40 Full Specs

3,584 Shaders
1.44GHz
10,752 Shaders
1.74GHz
24GB HBM2933.1GB/s
48GB GDDR6347.9GB/s
··
10.32 TFLOPS
··
37.42 TFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
165W
TDP
300W
Power Connectors
-
Power Connectors
1x 8-Pin EPS

A30A301.32 POPSINT4 Tensor Sparse
x1.10
A40A401.2 POPSINT4 Tensor Sparse
x1

Clock Speed
···
Clock Speed
···
Peak OPS
1.32 POPSINT4 Tensor Sparse
Peak OPS
1.2 POPSINT4 Tensor Sparse
Tensor FP16-16
165.2 TFLOPS
FP16-16 Tensor Sparse
330.3 TFLOPS
Tensor FP16-32
165.2 TFLOPS
FP16-32 Tensor Sparse
330.3 TFLOPS
Tensor FP16-16
149.7 TFLOPS
FP16-16 Tensor Sparse
299.3 TFLOPS
Tensor FP16-32
74.83 TFLOPS
FP16-32 Tensor Sparse
149.7 TFLOPS
BF16
20.64 TFLOPS
Tensor BF16
165.2 TFLOPS
BF16 Tensor Sparse
330.3 TFLOPS
BF16
37.42 TFLOPS
Tensor BF16
74.83 TFLOPS
BF16 Tensor Sparse
149.7 TFLOPS
Tensor TF32
82.58 TFLOPS
Tensor TF32
37.42 TFLOPS
FP32
10.32 TFLOPS
FP32
37.42 TFLOPS
FP64
5.16 TFLOPS
Tensor FP64
10.32 TFLOPS
FP64
584.6 GFLOPS
Tensor FP64
-
Tensor INT4
660.6 TOPS
Tensor INT4
598.7 TOPS
Tensor INT8
330.3 TOPS
Tensor INT8
299.3 TOPS
Ray
-
Ray
56.43 TOPS
Pixel Rate
138.2 GPixel/s
Pixel Rate
194.9 GPixel/s
Texture Rate
322.6 GTexel/s
Texture Rate
584.6 GTexel/s

Shaders
3,584 Shaders
Shaders
10,752 Shaders
TMUs
224 TMUs
TMUs
336 TMUs
ROPs
96 ROPs
ROPs
112 ROPs
Tensor Cores
224 T-Cores
Tensor Cores
336 T-Cores
RT Cores
-
RT Cores
84 RT-Cores
SMs
56 SMs
SMs
84 SMs

Base Clock
930MHz
Base Clock
1.3GHz
Boost Clock
1.44GHz
Boost Clock
1.74GHz

L2 Cache
24.6MB shared
L2 Cache
6.1MB shared

24GB HBM2
48GB GDDR6
Memory Bus
3072-bit
Memory Bus
384-bit
Memory Speed
2.4GT/s
Memory Speed
7.2GT/s
Memory Bandwidth
933.1GB/s
Memory Bandwidth
347.9GB/s

TDP
165W
TDP
300W

Multi-Monitor
-
Multi-Monitor
3
HDCP
-
HDCP
HDCP 2.3

-
3x DisplayPort 1.3

-
Encoder Model
NVENC 7

Decoder Model
5x NVDEC 4
Decoder Model
NVDEC 5

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
2-Slots
PCIe
2-Slots
Height
111 mm (4.37")
Width
267 mm (10.51")
Depth
40 mm (1.57")
Height
112 mm (4.41")
Width
267 mm (10.51")
Depth
40 mm (1.57")
Cooling
Passive
Cooling
Passive
Power Connectors
-
Power Connectors
1x 8-Pin EPS

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
A30 branding
Branding
A40 branding
Codename
NV170
Codename
NV172
Chip Variant
-
Chip Variant
GA102-200-KD-A1
Market Segment
Server
Market Segment
Server
Release Date
Apr 12, 2021
Release Date
Oct 5, 2020

Foundry
TSMC
Foundry
Samsung
Fabrication Node
7N
Fabrication Node
8N
Die Size
826mm²
Die Size
628mm²
Transistor Count
54.2 Billion
Transistor Count
28.3 Billion
Transistor Density
65.62 MTr/mm²
Transistor Density
45.04 MTr/mm²

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